Invention Grant
- Patent Title: Circuits using gate-all-around technology
- Patent Title (中): 使用门全能技术的电路
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Application No.: US14681523Application Date: 2015-04-08
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Publication No.: US09281363B2Publication Date: 2016-03-08
- Inventor: Chung-Hui Chen
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C.
- Agent Anthony King
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L27/088 ; H01L29/08 ; H01L29/10 ; H01L29/423 ; H01L29/78

Abstract:
A semiconductor structure includes a first gate-all-around (GAA) structure configured to form a first circuit and a second GAA structure configured to form a second circuit similar to the first circuit. The first GAA structure and the second GAA structure have a same of at least one of the following exemplary features: a number of GAA devices in which current flows from a first oxide definition (OD) region to a second OD region; a number of GAA devices in which current flows from the second OD region to the first OD region; a number of first OD region contact elements; a number of second OD region contact elements.
Public/Granted literature
- US20150303259A1 CIRCUITS USING GATE-ALL-AROUND TECHNOLOGY Public/Granted day:2015-10-22
Information query
IPC分类: