发明授权
- 专利标题: Method of fabricating a gate dielectric layer
- 专利标题(中): 制造栅极电介质层的方法
-
申请号: US14585802申请日: 2014-12-30
-
公开(公告)号: US09263546B2公开(公告)日: 2016-02-16
- 发明人: Wei-Yang Lee , Xiong-Fei Yu , Da-Yuan Lee , Kuang-Yuan Hsu
- 申请人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 申请人地址: TW
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址: TW
- 代理机构: Hauptman Ham, LLP
- 主分类号: H01L29/04
- IPC分类号: H01L29/04 ; H01L29/10 ; H01L29/66 ; H01L29/423 ; H01L21/8238 ; H01L21/28 ; H01L29/51
摘要:
A method of making a semiconductor device, the method includes forming an active region in a substrate. The method further includes forming a first gate structure over the active region, where the forming the first gate structure includes forming a first interfacial layer. An entirety of a top surface of the first interfacial layer is a curved convex surface. Furthermore, the method includes forming a first high-k dielectric over the first interfacial layer. Additionally, the method includes forming a first gate electrode over a first portion of the first high-k dielectric and surrounded by a second portion of the first high-k dielectric.
公开/授权文献
- US20150140765A1 METHOD OF FABRICATING A GATE DIELECTRIC LAYER 公开/授权日:2015-05-21
信息查询
IPC分类: