Invention Grant
- Patent Title: Plasma activated conformal film deposition
- Patent Title (中): 等离子体激活的保形膜沉积
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Application No.: US14231554Application Date: 2014-03-31
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Publication No.: US09230800B2Publication Date: 2016-01-05
- Inventor: Adrien LaVoie , Shankar Swaminathan , Hu Kang , Ramesh Chandrasekharan , Tom Dorsh , Dennis M. Hausmann , Jon Henri , Thomas Jewell , Ming Li , Bryan Schlief , Antonio Xavier , Thomas W. Mountsier , Bart J. van Schravendijk , Easwar Srinivasan , Mandyam Sriram
- Applicant: Novellus Systems, Inc.
- Applicant Address: US CA Fremont
- Assignee: Novellus Systems, Inc.
- Current Assignee: Novellus Systems, Inc.
- Current Assignee Address: US CA Fremont
- Agency: Weaver Austin Villeneuve & Sampson LLP
- Main IPC: H01L21/02
- IPC: H01L21/02 ; C23C16/04 ; C23C16/34 ; C23C16/40 ; C23C16/455 ; C23C16/56 ; H01L21/285 ; H01L21/67 ; H01L21/762 ; H01L21/768

Abstract:
Methods of depositing a film on a substrate surface include surface mediated reactions in which a film is grown over one or more cycles of reactant adsorption and reaction. In one aspect, the method is characterized by the following operations: (a) exposing the substrate surface to a first reactant in vapor phase under conditions allowing the first reactant to adsorb onto the substrate surface; (b) exposing the substrate surface to a second reactant in vapor phase while the first reactant is adsorbed on the substrate surface; and (c) exposing the substrate surface to plasma to drive a reaction between the first and second reactants adsorbed on the substrate surface to form the film.
Public/Granted literature
- US20140209562A1 PLASMA ACTIVATED CONFORMAL FILM DEPOSITION Public/Granted day:2014-07-31
Information query
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