发明授权
- 专利标题： Plug via formation by patterned plating and polishing
- 专利标题（中）： 通过图案电镀和抛光形成插头
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申请号： US14026158申请日： 2013-09-13
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公开(公告)号： US09159696B2公开(公告)日： 2015-10-13
- 发明人: Timothy H. Daubenspeck , Jeffrey P. Gambino , Ekta Misra , Christopher D. Muzzy , Wolfgang Sauter
- 申请人： International Business Machines Corporation
- 申请人地址： KY Grand Cayman
- 专利权人： GLOBALFOUNDRIES, INC.
- 当前专利权人： GLOBALFOUNDRIES, INC.
- 当前专利权人地址： KY Grand Cayman
- 代理机构： Thompson Hine LLP
- 代理商 Anthony J. Canale
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L23/00
摘要：
Solder bump connections and methods for fabricating solder bump connections. A passivation layer is formed on a dielectric layer. A via opening extends through the passivation layer from a top surface of the passivation layer to a metal line in the dielectric layer. A mask on the top surface of the passivation layer includes a mask opening that is aligned with the via opening. A conductive layer is selectively formed in the via opening and the mask opening. The conductive layer projects above the top surface of the passivation layer. The method further includes planarizing the passivation layer and the conductive layer to define a plug in the via opening that is coupled with the metal line.
公开/授权文献
- US20150076688A1 PLUG VIA FORMATION BY PATTERNED PLATING AND POLISHING 公开/授权日：2015-03-19
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