Invention Grant
- Patent Title: Method of manufacturing and insulating sheet
- Patent Title (中): 制造绝缘片的方法
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Application No.: US13137936Application Date: 2011-09-21
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Publication No.: US08997340B2Publication Date: 2015-04-07
- Inventor: Keungjin Sohn , Nobuyuki Ikeguchi , Joung-Gul Ryu , Ho-Sik Park , Sang-Youp Lee , Joon-Sik Shin , Jung-Hwan Park
- Applicant: Keungjin Sohn , Nobuyuki Ikeguchi , Joung-Gul Ryu , Ho-Sik Park , Sang-Youp Lee , Joon-Sik Shin , Jung-Hwan Park
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2008-0029210 20080328
- Main IPC: H05K3/02
- IPC: H05K3/02 ; B32B37/18 ; B29C65/00 ; B32B3/26 ; B32B15/08 ; B32B27/12 ; H05K1/05 ; B29K67/00 ; B29K101/12 ; B29K105/00 ; B29K105/06 ; B29K267/00 ; B29K277/00 ; B29K305/00 ; B29K305/02 ; B29K305/10 ; B29K305/12 ; B29L9/00 ; B29L31/34 ; B32B38/00 ; H05K1/03 ; H05K3/44 ; H05K3/46
Abstract:
A method of manufacturing an insulating sheet, the method including providing a reinforcement material having a thermoplastic resin layer stacked thereon; stacking the thermoplastic resin layer stacked on the reinforcement material over a core substrate; and hot pressing the reinforcement material and the thermoplastic resin layer onto the core substrate.
Public/Granted literature
- US20120012247A1 Method of manufacturing insulating sheet and printed circuit board having the same Public/Granted day:2012-01-19
Information query
