发明授权
- 专利标题： Quad flat semiconductor device with additional contacts
- 专利标题（中）： 具有附加触点的四方扁平半导体器件
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申请号： US13938231申请日： 2013-07-10
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公开(公告)号： US08981541B2公开(公告)日： 2015-03-17
- 发明人: Kong Bee Tiu , Ruzaini B. Ibrahim , Wai Yew Lo
- 申请人： Kong Bee Tiu , Ruzaini B. Ibrahim , Wai Yew Lo
- 申请人地址： US TX Austin
- 专利权人： Freescale Semiconductor, Inc.
- 当前专利权人： Freescale Semiconductor, Inc.
- 当前专利权人地址： US TX Austin
- 代理商 Charles Bergere
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/00
摘要：
A Quad Flat Package (QFP) semiconductor device has a multi-stepped lead frame for forming rows of external contacts. A semiconductor die is attached to a die pad of the lead frame and electrically connected to lead with bond wires. The die and bond wires are encapsulated with a mold compound and then multiple cuts are made to the lead frame to form the rows of external contacts.
公开/授权文献
- US20150014833A1 QUAD FLAT SEMICONDUCTOR DEVICE WITH ADDITIONAL CONTACTS 公开/授权日：2015-01-15
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