发明授权
US08952552B2 Semiconductor package assembly systems and methods using DAM and trench structures
有权
使用DAM和沟槽结构的半导体封装组装系统和方法
- 专利标题： Semiconductor package assembly systems and methods using DAM and trench structures
- 专利标题（中）： 使用DAM和沟槽结构的半导体封装组装系统和方法
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申请号： US12621839申请日： 2009-11-19
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公开(公告)号： US08952552B2公开(公告)日： 2015-02-10
- 发明人: Ruey Kae Zang , Wen-Sung Hsu
- 申请人： Ruey Kae Zang , Wen-Sung Hsu
- 申请人地址： US CA San Diego
- 专利权人： QUALCOMM Incorporated
- 当前专利权人： QUALCOMM Incorporated
- 当前专利权人地址： US CA San Diego
- 代理商 Michelle S. Gallardo
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/28 ; H01L21/56
摘要：
A packaging system for preventing underfill overflow includes a package substrate having a solder mask a die attach site, a solder mask dam on the solder mask proximal to the die attach site, and a trench in the solder mask proximal to the die attach site. The trench and the solder mask dam are adapted to constrain flow of an underfill material.
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