Invention Grant
- Patent Title: Semiconductor structure
- Patent Title (中): 半导体结构
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Application No.: US13710078Application Date: 2012-12-10
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Publication No.: US08951875B2Publication Date: 2015-02-10
- Inventor: King-Yuen Wong , Ming-Lung Cheng , Chien-Tai Chan , Da-Wen Lin , Chung-Cheng Wu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW
- Agency: Lowe Hauptman & Ham, LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L29/78 ; H01L29/10 ; H01L29/165 ; H01L29/66

Abstract:
A semiconductor structure includes a substrate, a gate structure, and two silicon-containing structures. The substrate includes two recesses defined therein and two doping regions of a first dopant type. Each of the two doping regions extends along a bottom surface and at least portion of a sidewall of a corresponding one of the two recesses. The gate structure is over the substrate and between the two recesses. The two silicon-containing structures are of a second dopant type different from the first dopant type. Each of the two silicon-containing structures fills a corresponding one of the two recesses, and an upper portion of each of the two silicon-containing structures has a dopant concentration higher than that of a lower portion of each of the two silicon-containing structures.
Public/Granted literature
- US20130099326A1 SEMICONDUCTOR STRUCTURE Public/Granted day:2013-04-25
Information query
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