发明授权
- 专利标题： High temperature operating package and circuit design
- 专利标题（中）： 高温运行封装和电路设计
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申请号： US13221179申请日： 2011-08-30
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公开(公告)号： US08803239B2公开(公告)日： 2014-08-12
- 发明人: Neill Thornton , Dennis Lang
- 申请人： Neill Thornton , Dennis Lang
- 申请人地址： US CA San Jose
- 专利权人： Fairchild Semiconductor Corporation
- 当前专利权人： Fairchild Semiconductor Corporation
- 当前专利权人地址： US CA San Jose
- 代理机构： Christensen O'Connor Johnson Kindness PLLC
- 主分类号： H01L21/70
- IPC分类号： H01L21/70 ; H01L27/11 ; H01L21/02 ; H01L29/417 ; H01L29/45
摘要：
The invention provides a semiconductor device that is thermally isolated from the printed circuit board such that the device operates at a higher temperature and radiates heat away from the printed circuit board. In another embodiment, the semiconductor is stacked onto a second device and optionally thermally isolated from the second device.
公开/授权文献
- US20120032712A1 HIGH TEMPERATURE OPERATING PACKAGE AND CIRCUIT DESIGN 公开/授权日：2012-02-09
信息查询
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