发明授权
- 专利标题： Substrate support
- 专利标题（中）： 基材支持
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申请号： US10376857申请日： 2003-02-27
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公开(公告)号： US06917755B2公开(公告)日： 2005-07-12
- 发明人: Andrew Nguyen , Gerhard Schneider , Akihiro Hosokawa , Takayuki Matsumoto
- 申请人： Andrew Nguyen , Gerhard Schneider , Akihiro Hosokawa , Takayuki Matsumoto
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Moser, Patterson & Sheridan LLP
- 主分类号： H01L21/683
- IPC分类号： H01L21/683 ; C23C16/458 ; C23C16/48 ; G02F1/13 ; H01L21/673 ; H01L21/687 ; F26B3/30
摘要：
An apparatus for supporting a substrate is described that has a ball adapted to minimize damage between the substrate support and the substrate supported thereon. In one embodiment, an apparatus for supporting a substrate includes ball disposed on an inclined ball support surface. The ball support surface is adapted to bias the ball toward one side of the ball support surface thereby providing space for the ball to roll as the substrate supported thereon changes in length when exposed to thermal influences. In another embodiment, the apparatus further comprises a cage adapted to capture the ball to the ball support surface.
公开/授权文献
- US20040170407A1 Substrate support 公开/授权日：2004-09-02
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