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    SWIMMING AID DEVICE
    3.
    发明申请
    SWIMMING AID DEVICE 审中-公开
    游泳设备

    公开(公告)号：US20160367860A1

    公开(公告)日：2016-12-22

    申请号：US15257848

    申请日：2016-09-06

    Applicant: Andrew Nguyen

    Inventor： Andrew Nguyen

    IPC: A63B31/11

    CPC classification number: A63B31/11 ,  A63B2209/00 ,  A63B2210/50

    Abstract: A swimming aid device in the form of a monofi is contemplated. The swimming aid device may include first and second fins formed of a resilient material, each fin including an elongated internal space within a fin body, an opening leading to the elongated internal space, a fin blade coupled to and extending away from the elongated internal space, a first and second side heel connectors on opposing sides of the opening leading to the elongated internal space and sized and shaped to mate with each other, a fin blade connector and a fin blade connector receiver on the fin blade and sized and shaped to mate with each other, the combination of the first and second fins forming a monofin.

    Abstract translation: 考虑到单体形式的游泳辅助装置。 游泳辅助装置可以包括由弹性材料形成的第一和第二鳍片，每个翼片包括翅片体内的细长内部空间，通向细长内部空间的开口，联接到并延伸远离细长内部空间的翅片叶片 ，在所述开口的相对侧上的通向所述细长内部空间的第一和第二侧跟部连接器，其尺寸和形状相互配合，翅片叶片连接器和鳍片连接器接收器，其尺寸和形状适于配合 彼此之间形成单峰的第一和第二鳍片的组合。

    Apparatus for controlling the temperature uniformity of a substrate
    4.
    发明授权
    Apparatus for controlling the temperature uniformity of a substrate 有权
    用于控制基板的温度均匀性的装置

    公开(公告)号：US09267742B2

    公开(公告)日：2016-02-23

    申请号：US12886255

    申请日：2010-09-20

    Applicant: Kallol Bera ,  Xiaoping Zhou ,  Douglas A. Buchberger, Jr. ,  Andrew Nguyen ,  Hamid Tavassoli ,  Surajit Kumar ,  Shahid Rauf

    Inventor： Kallol Bera ,  Xiaoping Zhou ,  Douglas A. Buchberger, Jr. ,  Andrew Nguyen ,  Hamid Tavassoli ,  Surajit Kumar ,  Shahid Rauf

    IPC: F25B29/00 ,  F28F3/12 ,  F28F13/00

    CPC classification number: F28F3/12 ,  F28F2013/001

    Abstract: Apparatus for controlling the thermal uniformity of a substrate. In some embodiments, the thermal uniformity of the substrate is controlled to be more uniform. In some embodiments, the thermal uniformity of the substrate is controlled to be non-uniform in a desired pattern. In some embodiments, an apparatus for controlling thermal uniformity of a substrate includes a substrate support having a support surface to support a substrate thereon. A plurality of flow paths having a substantially equivalent fluid conductance are disposed within the substrate support to flow a heat transfer fluid beneath the support surface.

    Abstract translation: 用于控制基板的热均匀性的装置。 在一些实施例中，将基板的热均匀性控制得更均匀。 在一些实施例中，基板的热均匀性被控制为以期望的图案不均匀。 在一些实施例中，用于控制衬底的热均匀性的装置包括具有用于在其上支撑衬底的支撑表面的衬底支撑件。 具有基本相当的流体电导的多个流动路径设置在基板支撑件内，以使传热流体在支撑表面下方流动。

    MULTI-MODE ETCH CHAMBER SOURCE ASSEMBLY
    5.
    发明申请
    MULTI-MODE ETCH CHAMBER SOURCE ASSEMBLY 审中-公开
    多模式蚀刻室源组件

    公开(公告)号：US20140262031A1

    公开(公告)日：2014-09-18

    申请号：US13893199

    申请日：2013-05-13

    Applicant: Sergey G. BELOSTOTSKIY ,  Alexander MARCACCI ,  Kartik RAMASWAMY ,  Srinivas D. NEMANI ,  Andrew NGUYEN ,  Yogananda SARODE

    Inventor： Sergey G. BELOSTOTSKIY ,  Alexander MARCACCI ,  Kartik RAMASWAMY ,  Srinivas D. NEMANI ,  Andrew NGUYEN ,  Yogananda SARODE

    IPC: H01J37/32

    CPC classification number: H01J37/3244 ,  H01J37/32091

    Abstract: A multi-chambered processing platform includes one or more multi-mode plasma processing systems. In embodiments, a multi-mode plasma processing system includes a multi-mode source assembly having a primary source to drive an RF signal on a showerhead electrode within the process chamber and a secondary source to generate a plasma with by driving an RF signal on an electrode downstream of the process chamber. In embodiments, the primary 7 source utilizes RF energy of a first frequency, while the secondary source utilizes RF energy of second, different frequency. The showerhead electrode is coupled to ground through a frequency dependent filter that adequately discriminates between the first and second frequencies for the showerhead electrode to be RF powered during operation of the primary source, yet adequately grounded during operation of the secondary plasma source without electrical contact switching or reliance on physically moving parts.

    Abstract translation: 多室处理平台包括一个或多个多模式等离子体处理系统。 在实施例中，多模式等离子体处理系统包括多模式源组件，该多模式源组件具有用于驱动处理室内的喷头电极上的RF信号的主要源，以及辅助源以通过在其上驱动RF信号来产生等离子体 电极在处理室的下游。 在实施例中，主7源使用第一频率的RF能量，而次级源利用第二频率的RF能量。 淋浴头电极通过频率相关的滤波器耦合到地面，该滤波器在初级源的操作期间充分地辨别喷头电极的第一和第二频率以进行RF供电，而在没有电接触切换的二级等离子体源的操作期间充分地接地 或依赖物理移动部件。

    METHODS OF ATTACHING A MODULE ON WAFER SUBSTRATE
    6.
    发明申请
    METHODS OF ATTACHING A MODULE ON WAFER SUBSTRATE 有权
    连接晶片上的模块的方法

    公开(公告)号：US20140202267A1

    公开(公告)日：2014-07-24

    申请号：US13797112

    申请日：2013-03-12

    Applicant: Vaibhaw Vishal ,  Andrew Nguyen ,  Kristopher K. Hearn ,  Mei Sun

    Inventor： Vaibhaw Vishal ,  Andrew Nguyen ,  Kristopher K. Hearn ,  Mei Sun

    IPC: H05K7/00

    CPC classification number: H01L21/67248 ,  Y10T29/53

    Abstract: Aspects of the present disclosure describe an attachment device for mounting a module to a substrate comprises a module leg with two ends and a module foot. One end of the module leg is configured to be attached to a bottom surface of the module and the other end of the module leg is configured to be attached to the module foot. At least a portion of the module foot is configured to be attached to the substrate. Also a portion of a surface area of the module foot is configured to be exposed outside of an area covered by the module. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

    Abstract translation: 本公开的方面描述了用于将模块安装到基板的附接装置，包括具有两端的模块腿和模块脚。 模块腿的一端构造成附接到模块的底表面，并且模块腿的另一端构造成附接到模块脚。 模块脚的至少一部分被配置成附接到基底。 模块脚的表面区域的一部分也被配置为暴露在由模块覆盖的区域的外部。 要强调的是，该摘要被提供以符合要求抽象的规则，允许搜索者或其他读者快速确定技术公开的主题。 提交它的理解是，它不会用于解释或限制权利要求的范围或含义。

    ABATEMENT AND STRIP PROCESS CHAMBER IN A LOAD LOCK CONFIGURATION
    8.
    发明申请
    ABATEMENT AND STRIP PROCESS CHAMBER IN A LOAD LOCK CONFIGURATION 审中-公开
    一个负载锁定配置中的消费和条带过程室

    公开(公告)号：US20130224953A1

    公开(公告)日：2013-08-29

    申请号：US13746831

    申请日：2013-01-22

    Applicant: Martin Jeffrey SALINAS ,  Paul B. REUTER ,  Andrew NGUYEN ,  Jared Ahmad LEE

    Inventor： Martin Jeffrey SALINAS ,  Paul B. REUTER ,  Andrew NGUYEN ,  Jared Ahmad LEE

    IPC: H01L21/306

    Abstract: Embodiments of the present invention a load lock chamber including two or more isolated chamber volumes, wherein one chamber volume is configured for processing a substrate and another chamber volume is configured to provide cooling to a substrate. One embodiment of the present invention provides a load lock chamber having at least two isolated chamber volumes formed in a chamber body assembly. The at least two isolated chamber volumes may be vertically stacked. A first chamber volume may be used to process a substrate disposed therein using reactive species. A second chamber volume may include a cooled substrate support.

    Abstract translation: 本发明的实施例是一种包括两个或多个隔离室容积的负载锁定室，其中一个室容积被配置用于处理衬底，另一个室体积被配置为向衬底提供冷却。 本发明的一个实施例提供了一种装载锁定室，其具有形成在室主体组件中的至少两个隔离室容积。 至少两个隔离室容积可以垂直堆叠。 可以使用第一室容积来处理其中使用反应物种的衬底。 第二室容积可以包括冷却的基底支撑件。

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