发明授权
- 专利标题: Non-contact system for measuring film thickness
- 专利标题(中): 用于测量膜厚度的非接触式系统
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申请号: US28417申请日: 1998-02-24
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公开(公告)号: US06108087A公开(公告)日: 2000-08-22
- 发明人: Mehrdad Nikoonahad , Shing Lee , Haiming Wang
- 申请人: Mehrdad Nikoonahad , Shing Lee , Haiming Wang
- 申请人地址: CA San Jose
- 专利权人: Kla-Tencor Corporation
- 当前专利权人: Kla-Tencor Corporation
- 当前专利权人地址: CA San Jose
- 主分类号: G01B21/08
- IPC分类号: G01B21/08 ; G01B17/02 ; G01N29/00 ; G01N29/24 ; G01N29/34 ; G01B9/02
摘要:
Thickness of a film in a sample may be detected by directing pump laser pulses to the surface of a sample to generate an acoustic pulse in a sample. The acoustic pulse propagates downwards until it reaches an interface between the bottom of the film and a substrate and is reflected back to the top surface of the film as a first echo. A reflection of the first echo propagates downwards and is again reflected back towards the surface as a second echo. Interferometry is used to measure the lapse of time between the first and second echos from which the thickness of the film may be determined.
公开/授权文献
- USD363796S Window component extrusion 公开/授权日:1995-10-31
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