A semiconductor package structure includes a first bottom electrical connector and first bottom via structures over the first bottom electrical connector. The semiconductor package structure also includes a trace of a first redistribution layer structure over the first bottom via structures and first via structures over the trace of the first redistribution layer structure. The semiconductor package structure also includes a trace of a second redistribution layer structure over the first via structures and second via structures over the trace of the second redistribution layer structure. The semiconductor package structure also includes a trace of a third redistribution layer structure over the second via structures and partially vertically overlapping the trace of the first redistribution layer structure. The trace of the first redistribution layer structure, the trace of the second redistribution layer structure, and the trace of the third redistribution layer structure extend in different directions.