Invention Publication
- Patent Title: SEMICONDUCTOR DEVICE HAVING A NECKED SEMICONDUCTOR BODY AND METHOD OF FORMING SEMICONDUCTOR BODIES OF VARYING WIDTH
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Application No.: US18608294Application Date: 2024-03-18
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Publication No.: US20240222509A1Publication Date: 2024-07-04
- Inventor: Bernhard SELL
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- The original application number of the division: US13995634 2013.06.19
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/02 ; H01L21/306 ; H01L21/308 ; H01L21/8234 ; H01L27/088 ; H01L27/092 ; H01L27/12 ; H01L29/06 ; H01L29/08 ; H01L29/10 ; H01L29/16 ; H01L29/165 ; H01L29/417 ; H01L29/49 ; H01L29/51 ; H01L29/66 ; H01L29/786 ; H10B12/00

Abstract:
Semiconductor devices having necked semiconductor bodies and methods of forming semiconductor bodies of varying width are described. For example, a semiconductor device includes a semiconductor body disposed above a substrate. A gate electrode stack is disposed over a portion of the semiconductor body to define a channel region in the semiconductor body under the gate electrode stack. Source and drain regions are defined in the semiconductor body on either side of the gate electrode stack. Sidewall spacers are disposed adjacent to the gate electrode stack and over only a portion of the source and drain regions. The portion of the source and drain regions under the sidewall spacers has a height and a width greater than a height and a width of the channel region of the semiconductor body.
Information query
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