发明公开
- 专利标题: TRENCH GATE TYPE IGBT
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申请号: US18073388申请日: 2022-12-01
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公开(公告)号: US20240120390A1公开(公告)日: 2024-04-11
- 发明人: TETSUYA OKADA , HIROKI ARAI
- 申请人: WILL SEMICONDUCTOR (SHANGHAI) CO. LTD.
- 申请人地址: JP SHANGHAI
- 专利权人: WILL SEMICONDUCTOR (SHANGHAI) CO. LTD.
- 当前专利权人: WILL SEMICONDUCTOR (SHANGHAI) CO. LTD.
- 当前专利权人地址: JP SHANGHAI
- 优先权: JP 22163011 2022.10.11
- 主分类号: H01L29/417
- IPC分类号: H01L29/417 ; H01L21/66 ; H01L29/06 ; H01L29/10 ; H01L29/40 ; H01L29/66 ; H01L29/739
摘要:
A trench gate type IGBT includes a plurality of trenches, including a plurality of gate trenches having a gate region inside, and a plurality of emitter trenches having an emitter region connected to an emitter electrode. A mesa section adjacent to the trench has a second mesa region, which does not function as a channel; and a contact, which connects the emitter electrode; the second mesa region being sandwiched between the gate trench and the emitter trench.
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IPC分类: