Invention Publication
- Patent Title: INTEGRATED CIRCUIT DEVICES INCLUDING STACKED ELEMENTS AND METHODS OF FORMING THE SAME
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Application No.: US17738393Application Date: 2022-05-06
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Publication No.: US20230275021A1Publication Date: 2023-08-31
- Inventor: BYOUNGHAK HONG , Jeonghyuk Yim , Inchan Hwang , Gilhwan Son , Seungyoung Lee , Saehan Park , Janggeun Lee , Myunghoon Jung , Seungchan Yun , Buhyun Ham , Kang-ILL Seo
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L23/522 ; H01L21/302 ; H01L21/8234
Abstract:
Integrated circuit devices may include a transistor, a passive device, a substrate extending between the transistor and the passive device and a power rail. The passive device may be spaced apart from the substrate. Each of the passive device and the power rail may have a first surface facing the substrate, and the first surface of the passive device is closer than the first surface of the power rail to the substrate.
Information query
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