- 专利标题： SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
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申请号： US17231310申请日： 2021-04-15
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公开(公告)号： US20220336359A1公开(公告)日： 2022-10-20
- 发明人: Chia-Kuei HSU , Ming-Chih YEW , Shu-Shen YEH , Po-Yao LIN , Shin-Puu JENG
- 申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 申请人地址： TW Hsinchu
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址： TW Hsinchu
- 主分类号： H01L23/538
- IPC分类号： H01L23/538 ; H01L21/768
摘要：
A semiconductor package structure includes a first bottom electrical connector, an interposer over the first bottom electrical connector, and a first top electrical connector over the first top via structures. The interposer includes first bottom via structures in contact with the first bottom electrical connector. The interposer also includes a first trace of a first redistribution layer structure over the first bottom via structures. The interposer also includes first via structures over the first redistribution layer. The interposer also includes a first trace of a second redistribution layer structure over the first via structures. The interposer also includes second via structures over the second redistribution layer structure. The first bottom via structures, the first via structures, and the second via structures are separated from each other in a top view.
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