- 专利标题: CONTROLLING ETCH ANGLES BY SUBSTRATE ROTATION IN ANGLED ETCH TOOLS
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申请号: US17737723申请日: 2022-05-05
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公开(公告)号: US20220260764A1公开(公告)日: 2022-08-18
- 发明人: Rutger MEYER TIMMERMAN THIJSSEN , Morgan EVANS , Joseph C. OLSON
- 申请人: Applied Materials, Inc.
- 申请人地址: US CA Santa Clara
- 专利权人: Applied Materials, Inc.
- 当前专利权人: Applied Materials, Inc.
- 当前专利权人地址: US CA Santa Clara
- 主分类号: G02B5/18
- IPC分类号: G02B5/18 ; H01J37/305 ; H01J37/20 ; H01J37/302
摘要:
Embodiments described herein relate to methods of forming gratings with different slant angles on a substrate and forming gratings with different slant angles on successive substrates using angled etch systems. The methods include positioning portions of substrates retained on a platen in a path of an ion beam. The substrates have a grating material disposed thereon. The ion beam is configured to contact the grating material at an ion beam angle relative to a surface normal of the substrates and form gratings in the grating material. The substrates are rotated about an axis of the platen resulting in rotation angles ϕ between the ion beam and a surface normal of the gratings. The gratings have slant angles relative to the surface normal of the substrates. The rotation angles ϕ selected by an equation ϕ=cos−1 (tan()/tan()).
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