Invention Application
- Patent Title: METHOD FOR DEPOSITING HIGH QUALITY PVD FILMS
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Application No.: US17016614Application Date: 2020-09-10
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Publication No.: US20210123156A1Publication Date: 2021-04-29
- Inventor: Zihao YANG , Mingwei ZHU , Nag B. PATIBANDLA , Yong CAO , Shumao ZHANG , Zhebo CHEN , Jean LU , Daniel Lee DIEHL , Xianmin TANG
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: C30B23/00
- IPC: C30B23/00 ; C30B29/40 ; C30B33/04 ; C23C14/06 ; C23C14/34 ; C23C14/54 ; C23C14/58

Abstract:
Embodiments described herein include a method for depositing a material layer on a substrate while controlling a bow of the substrate and a surface roughness of the material layer. A bias applied to the substrate while the material layer is deposited is adjusted to control the bow of the substrate. A bombardment process is performed on the material layer to improve the surface roughness of the material layer. The bias and bombardment process improve a uniformity of the material layer and reduce an occurrence of the material layer cracking due to the bow of the substrate.
Public/Granted literature
- US11802349B2 Method for depositing high quality PVD films Public/Granted day:2023-10-31
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