Invention Application
- Patent Title: PHYSICAL VAPOR DEPOSITION ( PVD) CHAMBER WITH REDUCED ARCING
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Application No.: US16285043Application Date: 2019-02-25
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Publication No.: US20200051795A1Publication Date: 2020-02-13
- Inventor: CHAO DU , YONG CAO , CHEN GONG , MINGDONG LI , FUHONG ZHANG , RONGJUN WANG , XIANMIN TANG
- Applicant: APPLIED MATERIALS, INC.
- Main IPC: H01J37/34
- IPC: H01J37/34 ; C23C14/34 ; H01J37/32

Abstract:
Embodiments of a process chamber are provided herein. In some embodiments, a process chamber includes a chamber body having an interior volume, a substrate support disposed in the interior volume, a target disposed within the interior volume and opposing the substrate support, a process shield disposed in the interior volume and having an upper portion surrounding the target and a lower portion surrounding the substrate support, the upper portion having an inner diameter that is greater than an outer diameter of the target to define a gap between the process shield and the target, and a gas inlet to provide a gas to the interior volume through the gap or across a front opening of the gap to substantially prevent particles from the interior volume from entering the gap during use.
Information query