- 专利标题: Dual circuit digital isolator
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申请号: US18051151申请日: 2022-10-31
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公开(公告)号: US12068237B2公开(公告)日: 2024-08-20
- 发明人: Sundar Chetlur , Maxim Klebanov , Cory Voisine , Kenneth Snowdon , Hsuan-Jung Wu
- 申请人: Allegro MicroSystems, LLC
- 申请人地址: US NH Manchester
- 专利权人: Allegro MicroSystems, LLC
- 当前专利权人: Allegro MicroSystems, LLC
- 当前专利权人地址: US NH Manchester
- 代理机构: Daly, Crowley, Mofford & Durkee, LLP
- 分案原申请号: US17067178 2020.10.09
- 主分类号: H01L23/52
- IPC分类号: H01L23/52 ; H01L21/8234 ; H01L23/522
摘要:
An apparatus including; a substrate; an isolator that is formed over the substrate, the isolator including a silicon shield layer that is formed between a first buried oxide (BOX) layer and a second BOX layer; a silicon layer having an oxide trench structure formed therein, the oxide trench structure being arranged to define a first silicon island and a second silicon island; a first electronic circuit that is formed over the first silicon island; and a second electronic circuit that is formed over the second silicon island, the first electronic circuit being electrically coupled to the first electronic circuit.
公开/授权文献
- US20230084169A1 DUAL CIRCUIT DIGITAL ISOLATOR 公开/授权日:2023-03-16
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