- 专利标题: Method of fabricating a perovskite-material based trench capacitor using rapid thermal annealing (RTA) methodologies
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申请号: US17649899申请日: 2022-02-03
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公开(公告)号: US11894417B2公开(公告)日: 2024-02-06
- 发明人: Niloy Mukherjee , Somilkumar J. Rathi , Jason Y. Wu , Pratyush Pandey , Zeying Ren , FNU Atiquzzaman , Gabriel Antonio Paulius Velarde , Noriyuki Sato , Mauricio Manfrini , Tanay Gosavi , Rajeev Kumar Dokania , Amrita Mathuriya , Ramamoorthy Ramesh , Sasikanth Manipatruni
- 申请人: Kepler Computing Inc.
- 申请人地址: US CA San Francisco
- 专利权人: KEPLER COMPUTING INC.
- 当前专利权人: KEPLER COMPUTING INC.
- 当前专利权人地址: US CA San Francisco
- 代理机构: MUGHAL GAUDRY & FRANKLIN PC
- 主分类号: H01L21/768
- IPC分类号: H01L21/768 ; H01L21/324 ; H10B53/30 ; H10N70/20 ; H10N70/00 ; H01L23/522 ; H01L49/02
摘要:
A memory device includes a first electrode comprising a first conductive nonlinear polar material, where the first conductive nonlinear polar material comprises a first average grain length. The memory device further includes a dielectric layer comprising a perovskite material on the first electrode, where the perovskite material includes a second average grain length. A second electrode comprising a second conductive nonlinear polar material is on the dielectric layer, where the second conductive nonlinear polar material includes a third grain average length that is less than or equal to the first average grain length or the second average grain length.
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