- 专利标题: Semiconductor device and method for manufacturing the same
-
申请号: US17456290申请日: 2021-11-23
-
公开(公告)号: US11817487B2公开(公告)日: 2023-11-14
- 发明人: Yuki Nakano
- 申请人: ROHM CO., LTD.
- 申请人地址: JP Kyoto
- 专利权人: ROHM CO., LTD.
- 当前专利权人: ROHM CO., LTD.
- 当前专利权人地址: JP Kyoto
- 代理机构: XSENSUS LLP
- 优先权: JP 13030018 2013.02.19
- 主分类号: H01L29/40
- IPC分类号: H01L29/40 ; H01L29/423 ; H01L29/66 ; H01L29/78 ; H01L29/06 ; H01L29/16 ; H01L29/20 ; H01L29/10
摘要:
A semiconductor device of the present invention includes a gate electrode buried in a gate trench of a first conductivity-type semiconductor layer, a first conductivity-type source region, a second conductivity-type channel region, and a first conductivity-type drain region formed in the semiconductor layer, a second trench selectively formed in a source portion defined in a manner containing the source region in the surface of the semiconductor layer, a trench buried portion buried in the second trench, a second conductivity-type channel contact region selectively disposed at a position higher than that of a bottom portion of the second trench in the source portion, and electrically connected with the channel region, and a surface metal layer disposed on the source portion, and electrically connected to the source region and the channel contact region.
公开/授权文献
信息查询
IPC分类: