- 专利标题： Integrated heat spreader (IHS) with heating element
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申请号： US16504698申请日： 2019-07-08
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公开(公告)号： US11798861B2公开(公告)日： 2023-10-24
- 发明人: Peng Li , Kelly P. Lofgreen , Manish Dubey , Bamidele Daniel Falola , Ken Hackenberg , Shenavia S. Howell , Sergio Antonio Chan Arguedas , Yongmei Liu , Deepak Goyal
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Akona IP
- 主分类号： H01L23/34
- IPC分类号： H01L23/34 ; H01L21/48 ; H01L23/433 ; H01L23/367
摘要：
Embodiments may relate to a microelectronic package that includes a lid coupled with a package substrate such that a die is positioned between the lid and the package substrate. The lid may include a heating element that is to heat an area between the lid and the die. Other embodiments may be described or claimed.
公开/授权文献
- US20210013117A1 INTEGRATED HEAT SPREADER (IHS) WITH HEATING ELEMENT 公开/授权日：2021-01-14
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