Invention Grant
- Patent Title: Integrated circuit and method of forming same and a system
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Application No.: US17692767Application Date: 2022-03-11
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Publication No.: US11681853B2Publication Date: 2023-06-20
- Inventor: Sheng-Hsiung Chen , Wen-Hao Chen , Hung-Chih Ou , Chun-Yao Ku , Shao-Huan Wang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Hauptman Ham, LLP
- Main IPC: G06F30/30
- IPC: G06F30/30 ; G06F30/398 ; G06F30/3315 ; G06F30/337 ; G06F30/396 ; G06F115/06 ; G06F119/06 ; G06F119/12 ; G06F30/392

Abstract:
A multi-bit flip-flop includes a first flip-flop, a second flip-flop and a first inverter. The first flip-flop has a first driving capability. The second flip-flop has a second driving capability different from the first driving capability. The first inverter is configured to receive a first clock signal on a first clock pin, and is configured to generate a second clock signal inverted from the first clock signal. The first flip-flop and the second flip-flop are configured to share at least the first clock pin.
Public/Granted literature
- US20220198122A1 INTEGRATED CIRCUIT AND METHOD OF FORMING SAME AND A SYSTEM Public/Granted day:2022-06-23
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