- Patent Title: Systems and methods for production of low oxygen content silicon
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Application No.: US17380393Application Date: 2021-07-20
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Publication No.: US11668020B2Publication Date: 2023-06-06
- Inventor: Gaurab Samanta , Parthiv Daggolu , Sumeet Bhagavat , Soubir Basak , Nan Zhang
- Applicant: GlobalWafers Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: GlobalWafers Co., Ltd.
- Current Assignee: GlobalWafers Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Armstrong Teasdale LLP
- Main IPC: C30B15/20
- IPC: C30B15/20 ; C30B29/06 ; C30B15/30 ; C30B15/10 ; C30B30/04

Abstract:
A method for producing a silicon ingot includes withdrawing a seed crystal from a melt that includes melted silicon in a crucible that is enclosed in a vacuum chamber containing a cusped magnetic field. At least one process parameter is regulated in at least two stages, including a first stage corresponding to formation of the silicon ingot up to an intermediate ingot length, and a second stage corresponding to formation of the silicon ingot from the intermediate ingot length to the total ingot length. During the second stage process parameter regulation may include reducing a crystal rotation rate, reducing a crucible rotation rate, and/or increasing a magnetic field strength relative to the first stage.
Public/Granted literature
- US20210348298A1 SYSTEMS AND METHODS FOR PRODUCTION OF LOW OXYGEN CONTENT SILICON Public/Granted day:2021-11-11
Information query
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