Invention Grant
- Patent Title: Semiconductor structure and methods of forming same
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Application No.: US16741364Application Date: 2020-01-13
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Publication No.: US11355635B2Publication Date: 2022-06-07
- Inventor: Chun-Hsiung Tsai , Kuo-Feng Yu , Kei-Wei Chen
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/78 ; H01L29/66 ; H01L21/223 ; H01L21/324 ; H01L21/225 ; H01L21/8238 ; H01L27/092 ; H01L21/3115

Abstract:
A semiconductor structure includes a substrate, a first semiconductor fin, a second semiconductor fin, and a first lightly-doped drain (LDD) region. The first semiconductor fin is disposed on the substrate. The first semiconductor fin has a top surface and sidewalls. The second semiconductor fin is disposed on the substrate. The first semiconductor fin and the second semiconductor fin are separated from each other at a nanoscale distance. The first lightly-doped drain (LDD) region is disposed at least in the top surface and the sidewalls of the first semiconductor fin.
Public/Granted literature
- US20200152792A1 Semiconductor Structure and Methods of Forming Same Public/Granted day:2020-05-14
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