Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17100963Application Date: 2020-11-23
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Publication No.: US11289572B1Publication Date: 2022-03-29
- Inventor: Cheng-Pu Chiu , Tzung-Ying Lee , Dien-Yang Lu , Chun-Kai Chao , Chun-Mao Chiou
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: CN202011153977.9 20201026
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/8238 ; H01L29/165 ; H01L29/45 ; H01L21/02 ; H01L27/092 ; H01L29/08 ; H01L29/06 ; H01L29/78

Abstract:
A semiconductor device includes a substrate having a logic region and a high-voltage (HV) region, a first gate structure on the HV region, a first epitaxial layer and a second epitaxial layer adjacent to one side of the first gate structure, a first contact plug between the first epitaxial layer and the second epitaxial layer, a third epitaxial layer and a fourth epitaxial layer adjacent to another side of the first gate structure, and a second contact plug between the third epitaxial layer and the fourth epitaxial layer. Preferably, a bottom surface of the first epitaxial layer is lower than a bottom surface of the first contact plug and a bottom surface of the third epitaxial layer is lower than a bottom surface of the second contact plug.
Information query
IPC分类: