Invention Grant
- Patent Title: Semiconductor device with silicon carbide body
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Application No.: US16412131Application Date: 2019-05-14
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Publication No.: US11195921B2Publication Date: 2021-12-07
- Inventor: Ralf Siemieniec , Thomas Aichinger , Romain Esteve , Ravi Keshav Joshi , Shiqin Niu
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102018111653.5 20180515,DE102019109368.6 20190409
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/16 ; H01L29/66 ; H01L29/423 ; H01L29/78

Abstract:
A semiconductor device includes a gate electrode and a gate dielectric. The gate electrode extends from a first surface of a silicon carbide body into the silicon carbide body. The gate dielectric is between the gate electrode and the silicon carbide body. The gate electrode includes a metal structure and a semiconductor layer between the metal structure and the gate dielectric.
Public/Granted literature
- US20190355819A1 Semiconductor Device with Silicon Carbide Body and Method of Manufacturing Public/Granted day:2019-11-21
Information query
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