- 专利标题： Interconnect structure for package-on-package devices
-
申请号： US16683672申请日： 2019-11-14
-
公开(公告)号： US11037861B2公开(公告)日： 2021-06-15
- 发明人: Jui-Pin Hung , Jing-Cheng Lin , Po-Hao Tsai , Yi-Jou Lin , Shuo-Mao Chen , Chiung-Han Yeh , Der-Chyang Yeh
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsinchu
- 代理机构： Slater Matsil, LLP
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L21/00 ; H01L23/48 ; H01L23/00 ; H01L23/528 ; H01L25/065 ; H01L23/538 ; H01L23/28 ; H01L23/498 ; H01L21/56 ; H01L25/10 ; H01L21/768 ; H01L21/82 ; H01L25/18 ; H01L25/00 ; H01L21/48 ; H01L23/31
摘要：
An interconnect structure and a method of forming an interconnect structure are provided. The interconnect structure is formed over a carrier substrate, upon which a die may also be attached. Upon removal of the carrier substrate and singulation, a first package is formed. A second package may be attached to the first package, wherein the second package may be electrically coupled to through vias formed in the first package.
公开/授权文献
- US20200083145A1 Interconnect Structure for Package-on-Package Devices 公开/授权日：2020-03-12
信息查询
IPC分类:
