Invention Grant
- Patent Title: Particle irradiation apparatus, beam modifier device, and semiconductor device including a junction termination extension zone
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Application No.: US16153186Application Date: 2018-10-05
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Publication No.: US10915029B2Publication Date: 2021-02-09
- Inventor: Roland Rupp , Rudolf Elpelt , Romain Esteve
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Design IP
- Priority: DE102015114429 20150828
- Main IPC: H01L29/16
- IPC: H01L29/16 ; H01L29/36 ; H01L29/66 ; G03F7/20 ; H01L21/04 ; H01J37/317 ; H01L29/861 ; H01L21/027 ; H01L23/544 ; H01L29/06

Abstract:
A semiconductor device is provided that includes a silicon carbide substrate including a main surface at which a plurality of doped zones are formed in a junction termination extension zone of the silicon carbide substrate, the plurality of doped zones are arranged such that a lateral dopant concentration gradient is formed that decreases from a central region of the silicon carbide substrate to an outer edge region of the silicon carbide substrate.
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