Invention Grant
- Patent Title: Production method for fabry-perot interference filter
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Application No.: US16065856Application Date: 2017-05-01
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Publication No.: US10908022B2Publication Date: 2021-02-02
- Inventor: Takashi Kasahara , Katsumi Shibayama , Masaki Hirose , Toshimitsu Kawai , Hiroki Oyama , Yumi Kuramoto
- Applicant: HAMAMATSU PHOTONICS K.K.
- Applicant Address: JP Hamamatsu
- Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee Address: JP Hamamatsu
- Agency: Faegre Drinker Biddle & Reath LLP
- Priority: JP2016-106269 20160527,JP2016-163928 20160824
- International Application: PCT/JP2017/017167 WO 20170501
- International Announcement: WO2017/203947 WO 20171130
- Main IPC: G01J3/26
- IPC: G01J3/26 ; B23K26/53 ; B23K26/00 ; B23K26/064 ; B81B3/00 ; B81C1/00 ; G01J3/02 ; G02B5/28 ; G02B26/00 ; B23K103/00 ; B23K101/40 ; B23K26/06

Abstract:
A method of manufacturing a Fabry-Perot interference filter includes a forming step of forming a first thinned region, a first mirror layer, a sacrificial layer, and a second mirror layer are formed on a first main surface of a wafer, and the first thinned region in which at least one of the first mirror layer, the sacrificial layer, and the second mirror layer is partially thinned along each of a plurality of lines is formed; a cutting step of cutting the wafer into a plurality of substrates along each of the plurality of lines by forming a modified region within the wafer along each of the plurality of lines through irradiation of a laser light, after the forming step; and a removing step of removing a portion from the sacrificial layer through etching, between the forming step and the cutting step or after the cutting step.
Public/Granted literature
- US20180373021A1 PRODUCTION METHOD FOR FABRY-PEROT INTERFERENCE FILTER Public/Granted day:2018-12-27
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