- 专利标题: Semiconductor device
-
申请号: US16044086申请日: 2018-07-24
-
公开(公告)号: US10784349B2公开(公告)日: 2020-09-22
- 发明人: Seigo Mori , Masatoshi Aketa
- 申请人: ROHM CO., LTD.
- 申请人地址: JP Kyoto
- 专利权人: ROHM CO., LTD.
- 当前专利权人: ROHM CO., LTD.
- 当前专利权人地址: JP Kyoto
- 代理机构: Hamre, Schumann, Mueller & Larson, P.C.
- 优先权: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1e70ba5f
- 主分类号: H01L29/15
- IPC分类号: H01L29/15 ; H01L29/16 ; H01L29/66 ; H01L29/739 ; H01L29/08 ; H01L29/06 ; H01L29/10 ; H01L29/78 ; H01L27/04 ; H01L29/12 ; H01L27/07
摘要:
A semiconductor device according to the present invention includes a semiconductor layer of SiC of a first conductivity type, a plurality of body regions of a second conductivity type formed in the surface portion of the semiconductor layer with each body region forming a unit cell, a source region of the first conductivity type formed in the inner portion of the body region, a gate electrode facing the body region across a gate insulating film, a drain region of the first conductivity type and a collector region of the second conductivity type formed in the rear surface portion of the semiconductor layer such that the drain region and the collector region adjoin each other, and a drift region between the body region and the drain region, wherein the collector region is formed such that the collector region covers a region including at least two unit cells in the x-axis direction along the surface of the semiconductor layer.
公开/授权文献
- US20180331185A1 SEMICONDUCTOR DEVICE 公开/授权日:2018-11-15
信息查询
IPC分类: