- 专利标题： Guard ring structure of semiconductor arrangement
-
申请号： US16206036申请日： 2018-11-30
-
公开(公告)号： US10510554B2公开(公告)日： 2019-12-17
- 发明人: Sheng-Fang Cheng , Chen-Chih Wu , Chien-Yuan Lee , Yen-Lin Liu
- 申请人： Taiwan Semiconductor Manufacturing Company Limited
- 申请人地址： TW Hsin-chu
- 专利权人： Taiwan Semiconductor Manufacturing Company Limited
- 当前专利权人： Taiwan Semiconductor Manufacturing Company Limited
- 当前专利权人地址： TW Hsin-chu
- 代理机构： Cooper Legal Group, LLC
- 主分类号： H01L21/26
- IPC分类号： H01L21/26 ; H01L21/3205 ; H01L29/78 ; H01L29/423 ; H01L29/06 ; H01L21/8234 ; H01L27/088 ; H01L21/265 ; H01L21/768
摘要：
Among other things, one or more semiconductor arrangements and techniques for forming such semiconductor arrangements are provided. A semiconductor arrangement comprises a first guard ring surrounding at least a portion of a device, and a first poly layer formed over the first guard ring.
公开/授权文献
- US20190109014A1 GUARD RING STRUCTURE OF SEMICONDUCTOR ARRANGEMENT 公开/授权日：2019-04-11
信息查询
IPC分类:
