Invention Grant
- Patent Title: Integrated bound-mode spectral/angular sensors
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Application No.: US15706440Application Date: 2017-09-15
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Publication No.: US10408673B2Publication Date: 2019-09-10
- Inventor: Steven R. J. Brueck , Alexander Neumann , Payman Zarkesh-Ha
- Applicant: STC.UNM
- Applicant Address: US NM Albuquerque
- Assignee: STC.UNM
- Current Assignee: STC.UNM
- Current Assignee Address: US NM Albuquerque
- Agency: MH2 Technology Law Group, LLP
- Main IPC: G01J5/02
- IPC: G01J5/02 ; G01J1/06 ; G01J3/02 ; G01J1/44 ; G01J3/18 ; G01J3/28 ; G02B6/122 ; G02B6/124 ; H01L27/144 ; H01L31/02 ; H01L31/0216 ; H01L31/0232 ; H01L31/103 ; G02B6/12

Abstract:
A 2-D sensor array includes a semiconductor substrate and a plurality of pixels disposed on the semiconductor substrate. Each pixel includes a coupling region and a junction region, and a slab waveguide structure disposed on the semiconductor substrate and extending from the coupling region to the region. The slab waveguide includes a confinement layer disposed between a first cladding layer and a second cladding layer. The first cladding and the second cladding each have a refractive index that is lower than a refractive index of the confinement layer. Each pixel also includes a coupling structure disposed in the coupling region and within the slab waveguide. The coupling structure includes two materials having different indices of refraction arranged as a grating defined by a grating period. The junction region comprises a p-n junction in communication with electrical contacts for biasing and collection of carriers resulting from absorption of incident radiation.
Public/Granted literature
- US20180024001A1 INTEGRATED BOUND-MODE SPECTRAL/ANGULAR SENSORS Public/Granted day:2018-01-25
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