Invention Grant
- Patent Title: Semiconductor device and method for fabricating the same
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Application No.: US15687929Application Date: 2017-08-28
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Publication No.: US10056375B2Publication Date: 2018-08-21
- Inventor: Doo-Young Lee , Sang-Hyun Lee , Myung-Hoon Jung , Do-Hyoung Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2014-0142655 20141021
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L27/088 ; H01L21/768 ; H01L21/28 ; H01L29/45 ; H01L29/417 ; H01L27/02 ; H01L21/8234 ; H01L29/78 ; H01L27/11

Abstract:
A semiconductor device includes a first gate pattern and a second gate pattern on a substrate, the first gate pattern having a first height and the second gate pattern having a second height, an insulating pattern on the substrate covering the first and second gate patterns, the insulating pattern including a trench exposing the substrate between the first and second gate patterns, a spacer contacting at least a portion of a sidewall of the insulating pattern within the trench, the spacer spaced apart from the first and second gate patterns and having a third height larger than the first and second heights, and a contact structure filling the trench.
Public/Granted literature
- US20170358573A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2017-12-14
Information query
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