The utility model discloses a high-heat-conductivity aluminum nitride full-ceramic LED packaging housing and relates to an LED packaging structure, and particularly to an aluminum nitride packaging housing for a large-power LED chip. The high-heat-conductivity aluminum nitride full-ceramic LED packaging housing comprises an aluminum nitride substrate which is divided into an upper layer and a lower layer. The upper layer of the aluminum nitride substrate is a lens bracket layer. The middle part of the lens bracket layer is provided with a circular hole. The lower layer of the aluminum nitride substrate is a line layer. A chip pad and circuits are fixed on the top surface of the line layer. A heat sink pad is fixed with the bottom surface of the line layer. A plurality of metalized through holes are arranged between the top surface and the bottom surface of the line layer. The heat sink pad is connected with the chip pad through the metalized through hole. The high-heat-conductivity aluminum nitride full-ceramic LED packaging housing has beneficial effects of high heat radiation effect, simple structure, high mechanical strength and high suitability for high-power LED packaging.