A semiconductor device is provided in which a light receiving element (1) (e.g. a CCD, an infrared ray sensor, a CMOS sensor, or an illumination sensor) is formed on a front surface of a semiconductor substrate (2), and a plurality of ball-shaped conductive terminals (11) is disposed on a back surface of the semiconductor substrate (2). Each of the conductive terminals (11) is electrically connected to a pad electrode (4) on the front surface of the semiconductor substrate (2) through a wiring layer (9). The wiring layers (9) and the conductive terminals (11) are formed on the back surface ofthe semiconductor substrate (2) except in a region overlapping the light receiving element (1) in a vertical direction, and are not disposed in a region overlapping the light receiving element (1). Aproblem can be solved that a pattern of a wiring formed on a back surface of a semiconductor substrate is reflected on an output image.