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发明公开
CN1527115A 薄膜晶体管及其电子器件和制造方法 有权

薄膜晶体管及其电子器件和制造方法
摘要：
提供一种在柔性基底上实现的薄膜半导体器件、使用该器件的电子器件、及其制造方法。该薄膜半导体器件包括一柔性基底、一形成在柔性基底上的半导体芯片、以及一密封该半导体芯片的保护盖层。该电子器件包括一柔性基底和形成在柔性基底上的半导体芯片，还包括密封半导体芯片的保护盖层。由于使用了保护盖层，提高了薄膜半导体器件抵抗基底弯曲所产生的应力的耐用性。
摘要（英）：

Provided are a thin film semiconductor device realized on a flexible substrate, an electronic device using the same, and a manufacturing method thereof. The thin film semiconductor device includes a flexible substrate, a semiconductor chip, which is formed on the flexible substrate, and a protective cap, which seals the semiconductor chip. The electronic device includes a flexible substrate and a semiconductor chip formed on the flexible substrate and further includes a protective cap that seals the semiconductor chip. The durability of the thin film semiconductor device against the stress due to the bending of the substrate is improved by using the protective cap.

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