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发明公开
CN110676174A 一种封装高速信号过孔优化设计方法 无效 - 驳回

一种封装高速信号过孔优化设计方法
摘要：
本发明公开了一种封装高速信号过孔优化设计方法，包括：（1）、对过孔连接盘的最小孔径进行设计；（2）、对过孔反焊盘的盘径进行设计；（3）、对过孔反焊盘的深度进行设计；（4）依据上述设计确定封装高速信号孔盘结构。针对封装引脚BGA焊盘位置的阻抗不连续特性，综合过孔连接盘盘径、过孔反盘盘径、过孔反盘深度等多维参数进行过孔阻抗扫描，优化确定封装高速信号孔盘结构，可以有效提高封装高速信号过孔阻抗，降低封装高速信号回波损耗，改善封装高速信号传输特性。
摘要（英）：

The invention discloses an optimal design method for a packaging high-speed signal via hole, which comprises the following steps of: (1) designing the minimum hole diameter of a via hole connecting disc, (2) designing the diameter of the via hole anti-bonding pad, (3) designing the depth of the via hole anti-bonding pad, and (4) determining the structure of the packaging high-speed signal hole disc according to the design. The method aims at the impedance discontinuity characteristic of the BGA bonding pad position of a packaging pin, the multi-dimensional parameters such as via hole connecting disc diameter, the via hole anti disc diameter and the via hole anti disc depth are integrated for via hole impedance scanning, a packaging high-speed signal hole disc structure is optimized and determined, the packaging high-speed signal via hole impedance can be effectively improved, return loss of the packaging high-speed signal is reduced, and the transmission characteristics of the packaging high-speed signal are improved.

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