Wafer processing equipment is disclosed. The wafer processing equipment includes: a wafer buffer module and two wafer processing systems, the two wafer processing systems are opposed to each other andcan work independently, each wafer processing system includes a polishing unit, first manipulator, transmission unit, a second manipulator and a cleaning unit, the polishing unit and the cleaning unit are disposed adjacent to each other, the cleaning unit is adjacent to the wafer buffer module, the first manipulator moves between the wafer buffer module and the transfer unit and between the transfer unit and the washing unit, the transfer unit is transferred between the first manipulator and the second manipulator, and the second manipulator is used for transferring the wafer for the polishing unit. As a result, the wafer buffer module and the two wafer processing systems cooperate, the two wafer processing systems can work independently and do not affect each other, and the production efficiency can be improved. Moreover, the wafer processing equipment has more flexible processes and the produced wafers have stronger adaptability.