The invention mainly relates to a power semiconductor device, and particularly relates to a power semiconductor packaging device used as a power switch and a manufacturing method thereof. A plastic packaging body is used for coating a chip, a base, a first pin and a second pin, the first pin and the second pin are respectively arranged at two corner part positions at one side of the bottom face of the plastic packaging body, and the bottom surface of the first pin and the bottom surface of the second pin are exposed from the bottom face of the plastic packaging body.