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发明授权
CN101145505B 基板处理装置和基板处理方法 有权

基板处理装置和基板处理方法
摘要：
本发明提供一种基板处理装置和基板处理方法。基板处理装置(1)具有挡住从处理液供给部(3)供给而从基板(9)上飞溅出来的处理液的防溅罩(41)。防溅罩(41)由绝缘材料形成。对防溅罩(41)的外周面(411b)实施亲水化处理，在处理基板(9)时，将水保持在防溅罩(41)的外周面(411b)上。由此，不会因由特殊的导电材料形成防溅罩而大幅度地增加基板处理装置(1)的制造成本，能够利用保持在外周面(411b)上的水来抑制纯水飞溅时产生的防溅罩(41)的带电电位，其结果是，能够防止因基板(9)的感应带电而引起在向基板(9)供给处理液时在基板(9)上产生放电。
摘要（英）：

A substrate processing apparatus has a cup part for receiving processing liquid which is applied from a processing liquid applying part and is splashed from a substrate, and the cup part is formed of electrical insulation material. Hydrophilic treatment is performed on an outer annular surface of the cup part and water is held on the outer annular surface of the cup part while processing the substrate. With this structure, charged potential of the cup part generated in splashing of pure water can be suppressed by the water held on the outer annular surface, without greatly increasing the manufacturing cost of the substrate processing apparatus by forming the cup part with special conductive material. As a result, it is possible to prevent electric discharge from occurring on the substratedue to induction charging of the substrate, in application of the processing liquid onto the substrate.

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