DATA CENTER AND PHASE CHANGE COOLANT DISTRIBUTION UNIT THEREOF

    公开(公告)号:US20240365517A1

    公开(公告)日:2024-10-31

    申请号:US18648302

    申请日:2024-04-26

    IPC分类号: H05K7/20

    CPC分类号: H05K7/20818 H05K7/20327

    摘要: A phase change coolant distribution unit includes a heat-exchanging chamber, a low-position heat-exchanging tube, a high-position heat-exchanging tube and a phase change fluid. The low-position heat-exchanging tube is disposed through the heat-exchanging chamber, and at least one portion thereof is located in the heat-exchanging chamber. The high-position heat-exchanging tube is disposed through the heat-exchanging chamber, and at least one portion thereof is located in the heat-exchanging chamber. The phase change fluid is disposed in the heat-exchanging chamber. A data center includes a server rack, the phase change coolant distribution unit, a heat-source end working fluid and a heat-source pump. The heat-source end working fluid is disposed in the low-position heat-exchanging tube and a heat-source chamber of the server rack. The heat-source pump is disposed between the heat-source chamber and the low-position heat-exchanging tube to drive the heat-source end working fluid to flow.

    HEAT CONDUCTION PLATE ASSEMBLY STRUCTURE
    4.
    发明公开

    公开(公告)号:US20240365514A1

    公开(公告)日:2024-10-31

    申请号:US18244212

    申请日:2023-09-08

    IPC分类号: H05K7/20

    CPC分类号: H05K7/2039

    摘要: A heat conduction plate assembly structure (1) includes a heat conduction plate (10) and a buffer pad (20). The heat conduction plate (10) includes a platform (11). The platform (11) includes an arc surface (111) attached to the heat-generating component (2) and an overflow slot (112) located on a side of the arc surface (111). The buffer pad (20) is fixed on the platform (11) and surrounds an outer side of the overflow slot (112). Therefore, a heat conduction plate assembly structure (1) with a desirable thermal conduction effect is provided to prevent the thermal conducting medium (50) from overflowing.

    HEAT DISSIPATION DEVICE
    5.
    发明公开

    公开(公告)号:US20240365500A1

    公开(公告)日:2024-10-31

    申请号:US18632785

    申请日:2024-04-11

    IPC分类号: H05K7/20

    CPC分类号: H05K7/20154 H05K7/20336

    摘要: A heat dissipation device includes an inclined heat pipe and a plurality of inclined heat dissipation fins. The inclined heat pipe includes an inclined heat dissipation area, and each inclined heat dissipation fin includes an inclined heat dissipation portion. In addition, the inclined heat dissipation area of the inclined heat pipe is fixed to the inclined heat dissipation portion so that the inclined heat dissipation area of the inclined heat pipe forms a predetermined angle relative to a horizontal plane.

    AUTOMATION FIELD DEVICE
    6.
    发明公开

    公开(公告)号:US20240365496A1

    公开(公告)日:2024-10-31

    申请号:US18687390

    申请日:2022-07-27

    IPC分类号: H05K7/14 H05K7/10

    CPC分类号: H05K7/1462 H05K7/10

    摘要: An automation field device includes a metallic field device housing enclosing an interior; a sensor element and/or actuator element placed on one side on the field device housing, —for actuating and/or acquiring a process variable; an electronic circuit that is arranged in the interior of the field device housing and is configured to provide and/or process a sensor and/or actuator signal for and/or from the sensor element and/or actuator element, the electronic circuit furthermore having at least one field contact plug for transmitting data and/or energy, the field contact plug being guided outward through an opening in the field device housing, a custom-fit plug sleeve being plugged over the field contact plug, said plug sleeve being welded onto the field device housing and being fastened to a retaining means arranged in the interior.

    DISPLAY DEVICE
    7.
    发明公开
    DISPLAY DEVICE 审中-公开

    公开(公告)号:US20240365489A1

    公开(公告)日:2024-10-31

    申请号:US18645247

    申请日:2024-04-24

    发明人: Kukyoul JEON

    IPC分类号: H05K5/02

    CPC分类号: H05K5/0234

    摘要: A display device is disclosed. The display device includes: a display module including a display panel; a bottom case on which the display module is movably mounted; and a top case hingedly connected to the bottom case.

    DISPLAY DEVICE
    9.
    发明公开
    DISPLAY DEVICE 审中-公开

    公开(公告)号:US20240365484A1

    公开(公告)日:2024-10-31

    申请号:US18646192

    申请日:2024-04-25

    摘要: According to some embodiments of the present specification, a display device may include a display panel including a display area where a plurality of sub-pixels are disposed and a non-display area, a back cover disposed under the display panel, and a roller and a rail disposed between the display panel and the back cover, wherein the rail may be disposed between two display panels, and the roller may be disposed on each of two side surfaces of each rail.

    HOUSING APPARATUS OF ELECTRICAL COMPONENTS
    10.
    发明公开

    公开(公告)号:US20240365483A1

    公开(公告)日:2024-10-31

    申请号:US18607414

    申请日:2024-03-15

    发明人: Hiroshi Endo

    摘要: A housing apparatus of electrical components may include a housing and a membrane. The housing may define at least a portion of a watertight housing chamber in which a plurality of electrical components are accommodated. The membrane may seal an opening of the housing. The opening may be in communication with the housing chamber. The opening may be positioned such that the plurality of electrical components are not exposed to water even if a predetermined amount of water entered the housing through the opening.