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公开(公告)号:US20250003750A1
公开(公告)日:2025-01-02
申请号:US18703565
申请日:2022-10-11
Inventor: Kazufumi NISHIKAWA , Yuki MAEGAWA
IPC: G01C19/5712 , G01P15/125 , G01P15/18
Abstract: A composite sensor includes angular velocity detection elements, acceleration detection elements, and a control circuit. The control circuit includes: acceleration averaging units; a decision processor for determining whether the composite sensor is in an applied state; an acceleration offset magnitude calculator; an acceleration corrector for applying an acceleration correction signal to an acceleration average signal to output a corrected acceleration signal; a signal processor for outputting a quaternion signal based on an angular velocity signal and a corrected acceleration signal; and an acceleration calculator for calculating acceleration information based on the quaternion signal. The acceleration offset magnitude calculator calculates, in accordance with the acceleration information when the composite sensor is not in the applied state, an acceleration correction signal when the composite sensor is in the applied state.
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公开(公告)号:US12181356B2
公开(公告)日:2024-12-31
申请号:US17641593
申请日:2020-09-04
Applicant: Robert Bosch GmbH
Inventor: Lars Tebje , Jochen Reinmuth , Johannes Classen
IPC: G01L19/00 , G01L9/00 , G01L13/02 , G01P1/00 , G01P15/125
Abstract: A micromechanical component for a pressure and inertial sensor device. The component includes a substrate having an upper substrate surface; a diaphragm having an inner diaphragm side oriented towards the upper substrate surface and an outer diaphragm side pointing away from the upper substrate surface, the inner diaphragm side bordering on an inner volume, in which a reference pressure is enclosed, and the diaphragm being able to be warped using a pressure difference between a pressure prevailing on its outer diaphragm side and the reference pressure; and a seismic mass situated in the inner volume, a sensor electrode, which projects out on the inner diaphragm side and extends into the inner volume, being displaceable with respect to the substrate due to a warping of the diaphragm. A pressure and inertial sensor device, and a method of manufacturing a micromechanical component for a pressure and inertial sensor device, are also described.
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公开(公告)号:US12153063B2
公开(公告)日:2024-11-26
申请号:US17736527
申请日:2022-05-04
Applicant: Robert Bosch GmbH
Inventor: Klaus Petzold , Reinhold Wolpert , Sebastian Guenther , Zoltan Szkupien
IPC: G01P15/08 , G01P15/125
Abstract: A micromechanical inertial sensor. The inertial sensor includes a first sensor element for measuring an inertial variable in a first frequency band, and a second sensor element for measuring a periodic acceleration in a second frequency band. The second frequency band is at least partially above the first frequency band.
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公开(公告)号:US12146893B2
公开(公告)日:2024-11-19
申请号:US17380601
申请日:2021-07-20
Applicant: Analog Devices, Inc.
Inventor: Xin Zhang
IPC: G01P15/18 , G01P15/08 , G01P15/125
Abstract: Microelectromechanical system (MEMS) accelerometers are described. The MEMS accelerometers may include multiple proof mass portions collectively forming one proof mass. The entirety of the proof mass may contribute to detection of in-plane acceleration and out-of-plane acceleration. The MEMS accelerometers may detect in-plane and out-of-plane acceleration in a differential fashion. In response to out-of-plane accelerations, some MEMS accelerometers may experience butterfly modes, where one proof mass portion rotates counterclockwise relative to an axis while at the same time another proof mass portion rotates clockwise relative to the same axis. In response to in-plane acceleration, the proof mass portions may experience common translational modes, where the proof mass portions move in the plane along the same direction.
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公开(公告)号:US20240345124A1
公开(公告)日:2024-10-17
申请号:US18298444
申请日:2023-04-11
Applicant: Atlantic Inertial Systems Inc.
Inventor: Richard A. Hull , Vasileios Tsachouridis
IPC: G01P1/00 , G01P15/125
CPC classification number: G01P1/006 , G01P15/125 , G01P2015/0805
Abstract: A Micro-Electrical-Mechanical-Systems (MEMS) accelerometer system includes a proof-mass device having a proof-mass that moves from an initial position in response to an input acceleration, a transducer connected to the proof-mass device to output a transducer signal correlating to movement and/or position of the proof-mass, and a driver configured to drive the proof-mass. A controller actively controls the driver to actively drive the proof-mass toward an initial position, and actively adjusts the drive signal based on a temperature signal (T) indicative of given temperature, a transducer voltage signal (Vref) indicative of a transducer voltage reference, and the transducer signal to actively generate a corrected drive signal and delivers the corrected drive signal to the driver to actively control the driver. The controller can also utilize a robust loop-shaping stabilization operation to produce both an unfiltered estimate of the input acceleration and an uncorrected drive signal to stabilize the proof mass.
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公开(公告)号:US12092653B2
公开(公告)日:2024-09-17
申请号:US17472126
申请日:2021-09-10
Applicant: STMicroelectronics, Inc.
Inventor: Davy Choi , Yamu Hu , Deyou Fang
IPC: G01P21/00 , G01P15/125 , G01R19/10 , G01R31/28
CPC classification number: G01P21/00 , G01P15/125 , G01R19/10 , G01R31/2829
Abstract: In one embodiment, a method for detecting functional state of a microelectromechanical (MEMS) sensor is described. The method includes monitoring an input common-mode feedback (ICMFB) voltage generated by an ICMFB circuit coupled to the MEMS sensor through a plurality of nodes. The method also includes determining, using the monitored ICMFB voltage, whether all of the plurality of nodes of the MEMS sensor are electrically connected to the ICMFB circuit.
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公开(公告)号:US12072350B2
公开(公告)日:2024-08-27
申请号:US17847979
申请日:2022-06-23
Applicant: Knowles Electronics, LLC
Inventor: Faisal Zaman , Shubham Shubham , Ken Deng
IPC: G01P15/125 , G01P1/00
CPC classification number: G01P15/125 , G01P1/00
Abstract: An anchor assembly for a microelectromechanical systems (MEMS) vibration sensor suspension comprises an anchor body and at least one spring integrally extending from the anchor body. Each spring comprises a first section integrally extending at a first end away from the anchor body to a second end, and first lateral portions of second and third sections extending in opposite lateral directions from the second end. Each of the second and third sections includes a first leg that extends at a first end from the first lateral portion toward the anchor body, a second lateral portion that extends from a second end of the first leg away from the first section, and a second leg that extends from the second lateral portion at a first end away from the anchor body, wherein second ends of the second legs extend farther from the anchor body than the first lateral portions.
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公开(公告)号:US20240230332A1
公开(公告)日:2024-07-11
申请号:US18208026
申请日:2023-06-09
Applicant: Motion Engine, Inc.
Inventor: Robert Mark Boysel , Louis Ross
IPC: G01C19/5712 , G01C19/5719 , G01C19/5733 , G01P15/08 , G01P15/125 , G01P15/18
CPC classification number: G01C19/5712 , G01C19/5719 , G01C19/5733 , G01P15/0802 , G01P15/125 , G01P15/18 , B81B2201/0235 , G01P2015/084
Abstract: A micro-electro-mechanical system (MEMS) motion sensor is provided that includes a MEMS wafer having a frame structure, a plurality of proof masses suspended to the frame structure, movable in three dimensions, and enclosed in one or more cavities. The MEMS sensor includes top and bottom cap wafers bonded to the MEMS wafer and top and bottom electrodes provided in the top and bottom cap wafers, forming capacitors with the plurality of proof masses, and being together configured to detect motions of the plurality of proof masses. The MEMS sensor further includes first electrical contacts provided on the top cap wafer and electrically connected to the top electrodes, and a second electrical contacts provided on the top cap wafer and electrically connected to the bottom electrodes by way of vertically extending insulated conducting pathways. A method for measuring acceleration and angular rate along three mutually orthogonal axes is also provided.
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公开(公告)号:US12025633B2
公开(公告)日:2024-07-02
申请号:US17652526
申请日:2022-02-25
Applicant: Vibration Measurement Solutions, Inc.
Inventor: George V. Zusman
IPC: G01P15/125 , G01P15/097 , G01P15/12 , G01P21/00 , G01D1/16 , G01D5/244 , G01R1/30
CPC classification number: G01P15/125 , G01P15/097 , G01P15/123 , G01P21/00 , G01D1/16 , G01D5/24476 , G01R1/30
Abstract: A two-wire reference accelerometer includes integrated mechanical transducing and self-calibration capability based on gravity only. The reference accelerometer includes an external two-wire connector and an internal three-wire transducer that responds to both steady-state acceleration and time-varying accelerations by producing a modulated transducer output signal having a steady-state waveform when the transducer senses steady state acceleration and a time-varying waveform when the transducer senses time-varying accelerations. A signal conditioning circuit conditions the transducer output signal and applies it to the two-wire electrical connector as a modulated reference accelerometer output signal. The transducer and the signal conditioning circuit can operate without modification in either a DUT calibration mode or a self-calibration mode. The self-calibration mode determines the 1 g output sensitivity of the reference accelerometer from first and second readings of the reference accelerometer output signal taken while the reference accelerometer rests on a non-accelerating surface in respective non-inverted and inverted orientations.
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公开(公告)号:US12013414B2
公开(公告)日:2024-06-18
申请号:US17879813
申请日:2022-08-03
Applicant: AAC Kaitai Technologies (Wuhan) CO., LTD
Inventor: Shitao Yan , Zhan Zhan , Shan Yang , Zhao Ma , Xiao Kan , Hongtao Peng , Yang Li , Veronica Tan , Yan Hong , Kahkeen Lai
IPC: G01P15/125 , G01P15/08 , G01P15/18
CPC classification number: G01P15/125 , G01P15/0802 , G01P15/18 , G01P2015/0848 , G01P2015/086
Abstract: A MEMS accelerometer includes a base, proof mass, at least one pair of seesaw structures, and an out-of-plane displacement detection component. The at least one pair of the seesaw structures are oppositely disposed and fixed on the base through anchor points, and the out-of-plane displacement detection component is configured to detect rotation of the at least one pair of the seesaw structures or out-of-plane linear motion of the proof mass. Linear displacement of the MEMS accelerometer is not only beneficial to improve linearity of a capacitive displacement detection, but also to other non-capacitive detection methods, such as optical displacement detection. In addition, a double coupling structure is adopted to jointly couple rotation of seesaws, and remaining translational and rotational modes of the seesaw structures are suppressed.
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