Wafer placement table
    3.
    发明授权

    公开(公告)号:US12237156B2

    公开(公告)日:2025-02-25

    申请号:US18166611

    申请日:2023-02-09

    Abstract: A wafer placement table includes an upper substrate including a ceramic substrate and having a wafer placement surface, a lower substrate disposed on a lower surface of the upper substrate including a refrigerant flow path or a refrigerant flow-path groove, a through hole extending through the lower substrate in an up-down direction to intersect with the refrigerant flow path or the refrigerant flow-path groove, a screw hole provided in the lower surface of the upper substrate, at a position facing the through hole, a screw member inserted from a lower surface of the lower substrate into the through hole and screwed into the screw hole, and a refrigerant-leakage prevention member that prevents the refrigerant from leaking out to the lower surface of the lower substrate through the through hole into which the screw member is inserted.

    Deflector and grid support assemblies for use in heat exchangers and heat exchangers having such assemblies therein

    公开(公告)号:US12235057B2

    公开(公告)日:2025-02-25

    申请号:US17813028

    申请日:2022-07-15

    Abstract: Support assemblies are described herein for use with heat exchanges, wherein the assemblies are deflector and grid support assemblies having a grid support structure formed of a series of interconnected strips and having a peripheral exterior configured to be positioned within an interior surface of a heat exchanger such that the grid support structure substantially extends across a transverse cross-section of the interior of a the tube heat exchanger, wherein the grid support has a first grid support surface and an opposite second grid support surface longitudinally spaced from the first grid surface, the grid support structure defines a plurality of passageways extending therethrough from the first to the second grid support surface, the passageways being configured to support longitudinally extending tubes of a heat exchanger passing substantially perpendicularly to the first grid support surface through the passageways from the first grid surface to the second grid surface without substantially obstructing interior flow the heat exchanger; and at least one deflector plate, each having a first deflector plate surface and an opposite second deflector plate surface, wherein the at least one deflector plate defines a plurality of tube receiving openings therethrough for supporting longitudinally extending tubes in a heat exchanger, the deflector plate configured to cover at least one or more surface areas of the first grid surface to substantially obstruct flow through the deflector plate; wherein the first grid surface is configured to receive the at least one deflector plate to form a deflector and grid support assembly.

    Heat exchanger
    5.
    发明授权

    公开(公告)号:US12235048B2

    公开(公告)日:2025-02-25

    申请号:US17922115

    申请日:2021-06-22

    Applicant: Hanon Systems

    Abstract: The present invention relates to a heat exchanger comprising: a header tank having a plurality of flow paths in which a heat exchange medium flows; multiple rows of tubes connected to the header tank; and heat radiation fins interposed between the tubes, wherein the tubes include a heat exchange part coupled to the heat radiation fins and a coupling part that is formed on a longitudinal end of the heat exchange part and coupled to the header tank, the width of the coupling part is formed to be less than the width of the heat exchange part so that the overall package size of the heat exchanger may be reduced, thus enabling a compact configuration, and the space between neighboring rows of the tubes may be reduced, thus making it possible to reduce the material of the heat radiation fins.

    COOLING SYSTEM FOR DECREASING THE TEMPERATURE OF A SOLUTION

    公开(公告)号:US20250060166A1

    公开(公告)日:2025-02-20

    申请号:US18450127

    申请日:2023-08-15

    Abstract: A cooling system is provided. The cooling system comprises a first solution tank configured for receiving a cooling fluid. The cooling system may also include a second solution tank within the first solution tank and configured for receiving a food edible solution. The cooling system may also include a cooling fluid tube coiled around the second solution tank. The cooling system may further include a food edible solution tube coiled around the cooling fluid tube and/or the second solution tank.

    MAGNETICALLY ENHANCED BOILER
    7.
    发明申请

    公开(公告)号:US20250060165A1

    公开(公告)日:2025-02-20

    申请号:US18449071

    申请日:2023-08-14

    Abstract: Techniques and systems involve a magnetically enhanced cryogenic boiler that produces, without requiring pumps, high pressure gaseous oxygen from liquid oxygen for use in a spacecraft or other applications. The boiler heats, using a heat exchanger element, a closed container of liquid oxygen to boil the liquid oxygen at constant volume and increasing the pressure in the container. When a desired target pressure is reached, the boiler may release and transfer the high pressure fluid into a gaseous oxygen accumulator for storage. Magnets may be used to draw low pressure liquid oxygen into the boiler and to keep the liquid oxygen on or near one or more heat exchanger elements in the boiler, by exploiting paramagnetism of oxygen. The magnets produce a magnetic field that maintains relatively strong thermal contact between the heat exchanger elements and the liquid oxygen, even in the absence of gravity.

    Dish washing machine with heat exchangers

    公开(公告)号:US12226065B2

    公开(公告)日:2025-02-18

    申请号:US17697586

    申请日:2022-03-17

    Abstract: A dish washing machine including a housing having an interior wash space and a liquid inlet. A spray nozzle sprays the liquid onto dishes. The machine further includes a heating tank for heating the liquid which is supplied to the rotating spray nozzle. A heat exchange system transfers heat from the liquid heated by the heating tank to the liquid added from the liquid inlet. The heat exchange system comprising a pipe system defining a first path therethrough and a second path therethrough, with the first heat exchange system transferring heat from liquid in the second path to liquid in the first path. A first surface portion of the pipe system of the first path engaging the liquid in the first path having a greater thermal conductivity than a second surface portion of the pipe system of the second path engaging the liquid in the second path.

    HEAT EXCHANGER AND BYPASS VALVE USED IN HEAT EXCHANGER

    公开(公告)号:US20250052528A1

    公开(公告)日:2025-02-13

    申请号:US18718277

    申请日:2022-12-08

    Applicant: Hanon Systems

    Abstract: The present invention relates to a heat exchanger and a bypass valve used in the heat exchanger, which are provided in consideration of cooling/heating performance. An object of the present invention is to provide a heat exchanger, which adopts a variable path in consideration of cooling/heating performance to solve a problem in which cooling performance and heating performance vary depending on the number of paths, and a bypass valve used in the heat exchanger. More specifically, another object of the present invention is to provide a heat exchanger, which is designed to change the number of paths in consideration of cooling/heating performance so as to be optimized for performance in a cooling mode and performance in a heating mode, and a bypass valve used in the heat exchanger.

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