POLYOLEFIN-BASED RESIN FILM
    2.
    发明申请

    公开(公告)号:US20230135527A1

    公开(公告)日:2023-05-04

    申请号:US17906283

    申请日:2021-03-25

    申请人: TOYOBO CO., LTD.

    摘要: The invention provides a polyolefin-based resin film formed from a polypropylene-based resin composition, the polyolefin-based resin film containing: in 100 parts by weight of a polypropylene-based resin composition, 40 to 97 parts by weight of a propylene-ethylene block copolymer; 0 to 50 parts by weight of a propylene-α olefin random copolymer or a propylene homopolymer; and 3 to 10 parts by weight of at least one type of an elastomer selected from the group consisting of an ethylene-propylene copolymer elastomer, a propylene-butene copolymer elastomer, and an ethylene-butene copolymer elastomer, wherein a heat shrinkage ratio in a longitudinal direction is not lower than 1% and not higher than 9%, and an x-axis orientation coefficient ΔNx calculated from a refractive index is not less than 0.0150 and not larger than 0.0250. The invention also provides a laminated body containing the polyolefin-based resin film, as well as a packaging body formed therefrom.

    DECORATIVE SHEET AND DECORATIVE RESIN MOLDED ARTICLE

    公开(公告)号:US20230133852A1

    公开(公告)日:2023-05-04

    申请号:US17915604

    申请日:2020-03-31

    摘要: The present invention provides a decorative sheet which is provided with a relief pattern in the outer surface, while having excellent chemical resistance, wherein the relief pattern is suitably maintained even after molding. A decorative sheet which is provided with a relief pattern in the outer surface, while sequentially having, from the outer side, at least a first protective layer that constitutes the relief pattern and a second protective layer. The first protective layer is formed of a cured product of a resin composition that contains an ionizing radiation curable resin and a thermoplastic resin; and the second protective layer is formed of a cured product of an ionizing radiation curable resin composition that contains a polycarbonate (meth)acrylate.

    METHOD OF FORMING A TRANSPARENT CONDUCTIVE MEMBER, AND A FREE-STANDING TRANSPARENT CONDUCTIVE FILM

    公开(公告)号:US20230125845A1

    公开(公告)日:2023-04-27

    申请号:US18045014

    申请日:2022-10-07

    申请人: XTPL S.A.

    摘要: Devices, systems, and methods related to a transparent conductive film are disclosed. In one aspect, a method of forming a transparent conductive member (e.g., a transparent conductive film) includes extruding a metallic nanoparticle composition from a capillary tube onto a temporary substrate to form an extrudate. The extrudate can include metallic nanoparticle lines. The method further includes sintering the extrudate and the temporary substrate, dispensing a photocurable polymer onto the temporary substrate, and laminating a second substrate to the photocurable polymer. The photocurable polymer and the extrudate are interposed between the temporary substrate and the second substrate. The method further includes curing the photocurable polymer to form a transparent polymer layer and separating the temporary substrate from the transparent layer to form the transparent conductive member. The transparent conductive member includes the transparent polymer layer and the extrudate embedded in the transparent polymer layer.

    Shrinkable film capable of being overlapped and heat sealed, preparation method therefor, and packaging bag prepared using same

    公开(公告)号:US11633945B2

    公开(公告)日:2023-04-25

    申请号:US16958128

    申请日:2018-09-17

    发明人: Johnson Song

    摘要: A shrinkable film capable of being overlapped and heat sealed, a preparation method for the film, and a packaging bag prepared using same, including outer surface layers and a heat sealing layer. Each outer surface layer includes a low-molecular weight compound and is subjected to electron cross-linking treatment, and the low-molecular weight compound is selected from paraffin, oleamide, stearic acid, and one or more of their derivatives. The low-molecular weight compound in each outer surface layer can, during overlapping and heat sealing, be migrated in a polymer under the action of being heated to influence movement of polymer molecular chains, and can be migrated to two molten interfaces to hinder mutual penetration of the polymer molecular chains. Further, by performing electronic cross-linking treatment on the outer surface layers, the outer surface layers form a polymer molecular chain cross-linking structure, and the movement of the polymer molecular chains is reduced.