Abstract:
A microwave circuit comprises a printed circuit board (PCB) on which is fabricated a circuit including passive components such as filters (40) formed by printed conductive patterns. In order to enhance the performance of the circuit, selected components such as filters are made with a greater precision on substrate material (41), such as alumina, having a higher dielectric constant than that of the printed circuit board material. The finished component is mounted on the printed circuit board and the conductive pattern is connected by wire bonds (48, 50) to microstrip tracks (51) of the printed circuit board.
Abstract:
An impedance matching circuit for providing a lossless target signal transmission and rejecting image signals of heterodyne and super-heterodyne transceiver. The impedance matching circuit includes a grounded metal membrane, a first microstrip line connected with an input circuit, a second microstrip line connected with an output circuit, and a third microstrip line connected with either the first microstrip line or the second microstrip line. The first microstrip line is not connected with the second microstrip line, and the length of the third microstrip line is equal to a quarter wavelength of an image signal. When the target signal and the image signal transmit to the impedance matching circuit, the image signal will bypass to a grounded metal membrane, and the target signal will transmit to the output circuit without signal decay through electromagnetic coupling of the first microstrip line and the second microstrip line.
Abstract:
A dielectric filter including: a &lgr;/2 resonator for generating resonance of ½-wavelength at a predetermined frequency, having both ends open-circuited or short-circuited; and a pair &lgr;/4 resonators respectively for generating resonance of ¼-wavelength at a frequency substantially equal to the predetermined frequency, each having one end open-circuited and the other end short-circuited; wherein the pair of &lgr;/4 resonators are disposed in proximity to each of both ends from the vicinity of the center of the &lgr;/2 resonator; a terminal coupling to the &lgr;/2 resonator is provided as an unbalanced terminal; and terminals coupling to the pair of &lgr;/4 resonators is used as a balanced terminal. In the above filter, the balanced-type input/output of signals can be performed without using a balun.
Abstract:
The invention comprises a high-frequency low-pass filter (200) The filter utilizes distributed capacitance and inductance elements (221-227) which are realized using a homogeneous and relatively rigid conductive part (220). The conductive part is located mainly air-insulated in an enclosed metal housing (210) which serves as a ground conductor for the signal. The housing comprises conductive partition walls (212-214) to prevent coupling between adjacent capacitive elements. The advantages of the construction include good power handling capacity, good breakdown characteristics, small losses and low manufacturing costs, among other things.
Abstract:
A band pass distributed element filter having real and imaginary transmission zeros by sequentially connecting half wavelength microstrip resonators and adding a cross coupling circuit has been difficult to implement as a planar circuit on the same plane, since the cross coupling circuit crosses one of the resonators. The distributed element filter is constructed by sequentially connecting n half wavelength microstrip resonators (n is an even number equal to or more than 4) each formed from a straight or hairpin microstrip line, wherein the number of straight microstrip lines and the number of hairpin microstrip lines are both odd, and wherein quarter wavelength straight microstrip lines for external circuit connection are coupled to the first and n th resonators, respectively, and a cross coupling circuit is connected to the microstrip lines of these resonators or to the ends coupled to the microstrip lines. A band pass filter can thus be realized using only a planar circuit by preventing the cross coupling circuit from crossing any one of the resonators.
Abstract:
A dielectric laminated device, has a layered product including a plurality of dielectric layers; and a plurality of strip line conductors arranged in the interior of the layered product, wherein the thickness of at least part of the side part of at least one strip line conductor among the plurality of strip line conductors is thicker than that of the central part.
Abstract:
The invention includes a filter element comprising a dielectric substrate and a strip conductive pattern formed on the dielectric substrate. The dielectric substrate has cavities with apertures on the surface of the dielectric substrate. The strip conductive pattern is formed over the apertures of the cavities to serve as inductance. The strip conductive pattern has an approximately uniform line width that effectively improves the production yield and reliability of the filter element.
Abstract:
In a complex circuit board, the positional relationships between element portions, including an electrode pattern, a dielectric substrate and a magnetic substrate, can be adjusted as desired, and the complex circuit board can be miniaturized. The complex circuit board includes a dielectric substrate and a magnetic substrate, a space being provided between the magnetic substrate and the dielectric substrate, and an electrode pattern provided between the dielectric substrate and the magnetic substrate, a capacitance element portion of the electrode pattern being provided adjacent or in contact with or spaced a predetermined distance from the dielectric substrate, and the inductance element portion of the electrode pattern being provided adjacent or in contact with or spaced a predetermined distance from the magnetic substrate.
Abstract:
A strip transmission filter having resonators with impedance skips in which the resonators are provided in a ceramic substrate. The strip transmission filter also includes capacitive couplings. The ceramic substrate has a metallic coating on all sides except for a face side. The coupling structures are at the face side of the substrate. The ceramic substrate is constructed in a stepped formation in a region of the coupling structures and at least one ground terminal. Thus, the adhesion of metallic coating is increased which, in turn, facilitates soldering.
Abstract:
High temperature superconductor mini-filters and mini-multiplexers utilize self-resonant spiral resonators and have very small size and very low cross-talk between adjacent channels.