公开(公告)号：US20120202364A1

公开(公告)日：2012-08-09

申请号：US13448914

申请日：2012-04-17

申请人： James RATHBURN

发明人： James RATHBURN

IPC分类号： H01R12/71 ,  H05K3/32 ,  H05K3/28 ,  B82Y30/00

CPC分类号： H01L23/48 ,  B82Y10/00 ,  H01R23/722 ,  H05K1/0231 ,  H05K1/113 ,  H05K1/141 ,  H05K3/32 ,  H05K3/3436 ,  H05K3/4038 ,  H05K3/4069 ,  H05K7/1069 ,  H05K7/1092 ,  H05K2201/049 ,  Y10T29/4913 ,  Y10T29/49147

摘要： An electrical interconnect providing an interconnect between contacts on an IC device and contact pads on a printed circuit board (PCB). The electrical interconnect includes a substrate with a plurality of through holes extending from a first surface to a second surface. A resilient material is located in the through holes. The resilient material includes an opening extending from the first surface to the second surface. A plurality of discrete, free-flowing conductive nano-particles are located in the openings of the resilient material. The conductive particles are substantially free of non-conductive materials. A plurality of first contact members are located in the through holes adjacent the first surface and a plurality of second contact members are located in the through holes adjacent the second surface. The first and second contact members are electrically coupled to the nano-particles.

摘要翻译： 提供IC器件上的触点与印刷电路板（PCB）上的接触焊盘之间的互连的电互连。 电互连包括具有从第一表面延伸到第二表面的多个通孔的基底。 弹性材料位于通孔中。 弹性材料包括从第一表面延伸到第二表面的开口。 多个离散的自由流动的导电纳米颗粒位于弹性材料的开口中。 导电颗粒基本上不含非导电材料。 多个第一接触构件位于邻近第一表面的通孔中，并且多个第二接触构件位于与第二表面相邻的通孔中。 第一和第二接触构件电耦合到纳米颗粒。

公开(公告)号：US20180062288A1

公开(公告)日：2018-03-01

申请号：US15680485

申请日：2017-08-18

申请人： FUJITSU LIMITED

发明人： Yoko Murata

IPC分类号： H01R12/71 ,  H01R43/26 ,  H01R12/91 ,  H01R13/50 ,  H01R13/24 ,  H01R12/70

CPC分类号： H01R12/714 ,  H01R12/7047 ,  H01R12/91 ,  H01R13/2407 ,  H01R13/50 ,  H01R23/722 ,  H01R43/26

摘要： A contact includes a spring that has a curved portion and conductivity, a first contact portion that is a part of the curved portion raised from a bottom portion of a housing that holds the spring, the first contact portion comes in contact with a board to which the bottom portion is fixed, and a second contact portion that is a part of the curved portion raised from a lateral portion of the housing, the second contact portion comes in contact with another member placed next to the board.

公开(公告)号：US20160181707A1

公开(公告)日：2016-06-23

申请号：US14576365

申请日：2014-12-19

申请人： Siemens Energy, Inc.

发明人： Joshua S. McConkey

IPC分类号： H01R4/30 ,  H01R4/02

CPC分类号： H01R4/304 ,  H01R4/01 ,  H01R4/021 ,  H01R4/023 ,  H01R4/2437 ,  H01R4/245 ,  H01R4/26 ,  H01R4/302 ,  H01R4/34 ,  H01R4/36 ,  H01R4/46 ,  H01R9/096 ,  H01R12/52 ,  H01R23/722 ,  H01R23/725

摘要： An electrical arrangement (10), including: a first conductor (12) having a first generally planar contact area (34); a second conductor (12) having a second generally planar contact area (40); an intermediate conductor (44) having a first faying area (84) overlying the first contact area and a second faying area (86) overlying the second contact area; a compression arrangement configured to compress the first faying area and the first contact area toward each other and to compress the second faying area and the second contact area toward each other; and a dimpling structure (46) effective to create plural contact points (74) between the first faying area and the first contact area and between the second faying area and the second contact area when the first and the second faying areas and the first and second contact areas are compressed toward each other by the compression arrangement.

摘要翻译： 一种电气装置（10），包括：第一导体（12），具有第一大致平面的接触区域（34）; 具有第二大致平面的接触区域（40）的第二导体（12）; 具有覆盖在第一接触区域上的第一引线区域（84）和覆盖第二接触区域的第二引线区域（86）的中间导体（44） 压缩装置，其被构造为将所述第一接合区域和所述第一接触区域朝向彼此压缩并且朝向彼此压缩所述第二接合区域和所述第二接触区域; 以及凹坑结构（46），其有效地在所述第一和第二引信区域与所述第一和第二接合区域之间产生在所述第一接合区域和所述第一接触区域之间以及所述第二接合区域和所述第二接合区域之间的多个接触点（74） 接触区域通过压缩装置彼此压缩。

公开(公告)号：US09166319B2

公开(公告)日：2015-10-20

申请号：US14056316

申请日：2013-10-17

申请人： Tyco Electronics Corporation

发明人： Charles Raymond Gingrich, III ,  Matthew Edward Mostoller

IPC分类号： H01R12/77 ,  H01R12/62 ,  H01R13/506 ,  H01R12/79 ,  H01R13/24 ,  H01R12/70 ,  H01R13/627 ,  H01R13/629 ,  H01R12/72 ,  H01R12/50

CPC分类号： H01R12/778 ,  H01R12/62 ,  H01R12/7011 ,  H01R12/721 ,  H01R12/771 ,  H01R12/777 ,  H01R12/79 ,  H01R13/24 ,  H01R13/506 ,  H01R13/627 ,  H01R13/62988 ,  H01R23/722

摘要： A flexible circuit board connector includes a contact having a separable mating interface mounted to a contact pad of a flexible circuit board and a terminating end terminated to a wire. A housing holds the contact and has a main body including a wire barrel configured to receive the wire. A clip is coupled to the housing with an intermediate space between the clip and the main body. The clip is movable between an open position and a closed position. The intermediate space is configured to receive the flexible circuit board when the clip is in the open position, and the clip and housing are configured to capture the flexible circuit board when the clip is in the closed position. The spring beam is configured to be electrically connected to the contact pad when the clip is in the closed position.

摘要翻译： 柔性电路板连接器包括具有安装到柔性电路板的接触焊盘和端接到电线的端接端的可分离配合接口的触点。 壳体保持接触，并且具有主体，该主体包括构造成接收线的线筒。 夹子在夹子和主体之间具有中间空间连接到壳体。 夹子可在打开位置和关闭位置之间移动。 中间空间构造成当夹子处于打开位置时接收柔性电路板，并且夹子和壳体构造成当夹子处于关闭位置时捕获柔性电路板。 当夹子处于关闭位置时，弹簧梁构造成电连接到接触垫。

公开(公告)号：US09033716B2

公开(公告)日：2015-05-19

申请号：US13952935

申请日：2013-07-29

申请人： Apple Inc.

发明人： Jason Sloey ,  Varun Sehrawat

IPC分类号： H01R12/00 ,  H01R12/50 ,  H05K1/11

CPC分类号： H01R23/722 ,  H01R12/52 ,  H01R12/716 ,  H01R12/73 ,  H01R13/2414 ,  H05K1/11 ,  H05K1/111 ,  H05K1/147 ,  H05K3/361 ,  H05K3/368 ,  H05K2201/10189

摘要： Contact pads on structures such as printed circuits may be coupled to each other using printed circuit connectors such as board-to-board connectors. A printed circuit connector may have interlocking metal frame structures. The metal frame structures may be soldered to traces on the printed circuits. Rectangular openings in the metal frame structures may receive a rectangular contact array structure that is separate from the metal frame structures. The contact array structure may include a dielectric carrier structure and an array of conductive contacts. The dielectric carrier structure may align the contacts with respect to pads on the printed circuits to which the metal frame structures are soldered. The contacts may be formed from metal spring structures or conductive elastomeric structures that are compressed between respective printed circuit contact pads when the metal frame structures of a printed circuit connector are attached to each other.

摘要翻译： 诸如印刷电路的结构上的接触垫可以使用诸如板对板连接器的印刷电路连接器彼此耦合。 印刷电路连接器可以具有互锁的金属框架结构。 金属框架结构可以焊接到印刷电路上的迹线。 金属框架结构中的矩形开口可以接收与金属框架结构分开的矩形接触阵列结构。 接触阵列结构可以包括介电载体结构和导电接触阵列。 电介质载体结构可以使触点相对于金属框架结构被焊接到的印刷电路上的焊盘进行对准。 触点可以由金属弹簧结构或导电弹性体结构形成，当印刷电路连接器的金属框架结构彼此附接时，金属弹簧结构或导电弹性体结构被压缩在相应的印刷电路接触垫之间。

公开(公告)号：US20150111410A1

公开(公告)日：2015-04-23

申请号：US14056316

申请日：2013-10-17

申请人： Tyco Electronics Corporation

发明人： Charles Raymond Gingrich, III ,  Matthew Edward Mostoller

IPC分类号： H01R12/77

CPC分类号： H01R12/778 ,  H01R12/62 ,  H01R12/7011 ,  H01R12/721 ,  H01R12/771 ,  H01R12/777 ,  H01R12/79 ,  H01R13/24 ,  H01R13/506 ,  H01R13/627 ,  H01R13/62988 ,  H01R23/722

摘要： A flexible circuit board connector includes a contact having a separable mating interface mounted to a contact pad of a flexible circuit board and a terminating end terminated to a wire. A housing holds the contact and has a main body including a wire barrel configured to receive the wire. A clip is coupled to the housing with an intermediate space between the clip and the main body. The clip is movable between an open position and a closed position. The intermediate space is configured to receive the flexible circuit board when the clip is in the open position, and the clip and housing are configured to capture the flexible circuit board when the clip is in the closed position. The spring beam is configured to be electrically connected to the contact pad when the clip is in the closed position.

摘要翻译： 柔性电路板连接器包括具有安装到柔性电路板的接触焊盘和端接到电线的端接端的可分离配合接口的触点。 壳体保持接触，并且具有主体，该主体包括构造成接收线的线筒。 夹子在夹子和主体之间具有中间空间连接到壳体。 夹子可在打开位置和关闭位置之间移动。 中间空间构造成当夹子处于打开位置时接收柔性电路板，并且夹子和壳体构造成当夹子处于关闭位置时捕获柔性电路板。 当夹子处于关闭位置时，弹簧梁构造成电连接到接触垫。

公开(公告)号：US09136624B1

公开(公告)日：2015-09-15

申请号：US13852183

申请日：2013-03-28

申请人： Juniper Networks, Inc.

发明人： Boris Reynov ,  Venkata S. Raju Penmetsa ,  Ben T. Nitzan ,  Jack W. Kohn ,  Oscar Diaz-Landa ,  Shreeram Siddhaye

IPC分类号： H01R12/00 ,  H01R12/72 ,  H01R43/20 ,  H01R12/50

CPC分类号： H01R23/722 ,  H01R12/7082 ,  H01R12/724 ,  H01R12/737 ,  H05K1/181 ,  H05K3/308 ,  H05K3/366 ,  H05K3/429 ,  H05K7/1444 ,  H05K7/1445 ,  H05K2201/09518 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10492 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2201/1059

摘要： A line card of a set of line cards is configured to be coupled to a set of switch-fabric cards to collectively define at least a portion of an orthogonal cross fabric without a midplane board. The line card has an edge portion, a first side and a second side, opposite the first side. The line card includes a set of first set of connectors and a second set of connectors. The first set of connectors is disposed along the edge portion on the first side of the line card and the second set of connectors is disposed along the edge portion on the second side of the line card.

摘要翻译： 一组线路卡的线路卡被配置为耦合到一组交换网卡，以共同限定正交交叉结构的至少一部分而没有中间板。 线卡具有与第一侧相对的边缘部分，第一侧和第二侧。 线卡包括一组第一组连接器和第二组连接器。 第一组连接器沿着线卡的第一侧上的边缘部分布置，并且第二组连接器沿着线卡的第二侧的边缘部分设置。

公开(公告)号：US20150171528A1

公开(公告)日：2015-06-18

申请号：US14204769

申请日：2014-03-11

申请人： LOTES CO., LTD

发明人： Yong Quan Wu ,  Martinson Robert Ronald

IPC分类号： H01R12/70

CPC分类号： H01R12/7082 ,  H01R12/714 ,  H01R23/722

摘要： An electrical connector includes at least one body, a frame having at least one accommodating area for accommodating the body, a supporting cover, multiple signal terminals, and at least one grounding terminal. The body has an upper surface and a lower surface which are both smooth planes, multiple signal receiving slots and at least one grounding receiving slot. A conducting layer is disposed at the upper surface and extends to the grounding receiving slot. The upper surface has an isolation area at a position adjacent to the periphery of each signal receiving slot. The isolation area does not have the conducting layer. The supporting cover is assembled to the frame, covers the body, and used for supporting the chip module disposed on the supporting cover. The terminals are respectively received in the receiving slots, and passing through the supporting cover to be electrically connected to the chip module.

摘要翻译： 电连接器包括至少一个主体，具有用于容纳主体的至少一个容纳区域的框架，支撑盖，多个信号端子和至少一个接地端子。 主体具有平滑平面，多个信号接收槽和至少一个接地接收槽的上表面和下表面。 导电层设置在上表面并延伸到接地接收槽。 上表面在与每个信号接收槽的周边相邻的位置处具有隔离区域。 隔离区域不具有导电层。 支撑盖组装到框架上，覆盖主体，并用于支撑设置在支撑盖上的芯片模块。 端子分别容纳在接收槽中，并通过支撑盖电连接到芯片模块。

公开(公告)号：US09039426B1

公开(公告)日：2015-05-26

申请号：US14204769

申请日：2014-03-11

申请人： LOTES CO., LTD.

发明人： Yong Quan Wu ,  Martinson Robert Ronald

IPC分类号： H01R12/00 ,  H01R12/70 ,  H01R12/50

CPC分类号： H01R12/7082 ,  H01R12/714 ,  H01R23/722

摘要： An electrical connector includes at least one body, a frame having at least one accommodating area for accommodating the body, a supporting cover, multiple signal terminals, and at least one grounding terminal. The body has an upper surface and a lower surface which are both smooth planes, multiple signal receiving slots and at least one grounding receiving slot. A conducting layer is disposed at the upper surface and extends to the grounding receiving slot. The upper surface has an isolation area at a position adjacent to the periphery of each signal receiving slot. The isolation area does not have the conducting layer. The supporting cover is assembled to the frame, covers the body, and used for supporting the chip module disposed on the supporting cover. The terminals are respectively received in the receiving slots, and passing through the supporting cover to be electrically connected to the chip module.

摘要翻译： 电连接器包括至少一个主体，具有用于容纳主体的至少一个容纳区域的框架，支撑盖，多个信号端子和至少一个接地端子。 主体具有平滑平面，多个信号接收槽和至少一个接地接收槽的上表面和下表面。 导电层设置在上表面并延伸到接地接收槽。 上表面在与每个信号接收槽的周边相邻的位置处具有隔离区域。 隔离区域不具有导电层。 支撑盖组装到框架上，覆盖主体，并用于支撑设置在支撑盖上的芯片模块。 端子分别容纳在接收槽中，并通过支撑盖电连接到芯片模块。

公开(公告)号：US20150031221A1

公开(公告)日：2015-01-29

申请号：US13952935

申请日：2013-07-29

申请人： Apple Inc.

发明人： Jason Sloey ,  Varun Sehrawat

IPC分类号： H01R12/50 ,  H05K1/11

CPC分类号： H01R23/722 ,  H01R12/52 ,  H01R12/716 ,  H01R12/73 ,  H01R13/2414 ,  H05K1/11 ,  H05K1/111 ,  H05K1/147 ,  H05K3/361 ,  H05K3/368 ,  H05K2201/10189

摘要： Contact pads on structures such as printed circuits may be coupled to each other using printed circuit connectors such as board-to-board connectors. A printed circuit connector may have interlocking metal frame structures. The metal frame structures may be soldered to traces on the printed circuits. Rectangular openings in the metal frame structures may receive a rectangular contact array structure that is separate from the metal frame structures. The contact array structure may include a dielectric carrier structure and an array of conductive contacts. The dielectric carrier structure may align the contacts with respect to pads on the printed circuits to which the metal frame structures are soldered. The contacts may be formed from metal spring structures or conductive elastomeric structures that are compressed between respective printed circuit contact pads when the metal frame structures of a printed circuit connector are attached to each other.

摘要翻译： 诸如印刷电路的结构上的接触垫可以使用诸如板对板连接器的印刷电路连接器彼此耦合。 印刷电路连接器可以具有互锁的金属框架结构。 金属框架结构可以焊接到印刷电路上的迹线。 金属框架结构中的矩形开口可以接收与金属框架结构分开的矩形接触阵列结构。 接触阵列结构可以包括介电载体结构和导电接触阵列。 电介质载体结构可以使触点相对于金属框架结构被焊接到的印刷电路上的焊盘进行对准。 触点可以由金属弹簧结构或导电弹性体结构形成，当印刷电路连接器的金属框架结构彼此附接时，金属弹簧结构或导电弹性体结构被压缩在相应的印刷电路接触垫之间。