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    MORTAR PEELING DEVICE
    1.
    发明申请
    MORTAR PEELING DEVICE 有权
    MORTAR剥皮装置

    公开(公告)号：US20150107570A1

    公开(公告)日：2015-04-23

    申请号：US14361839

    申请日：2012-12-05

    申请人： Marutaka-Kogyo Inc.

    发明人： Kazumasa Takagi ,  Eizou Takagi ,  Masayuki Asakura ,  Tatsuya Ida

    IPC分类号： E04G23/02 ,  B28D1/00 ,  E04G23/00

    CPC分类号： E04G23/0296 ,  B28D1/00 ,  B28D1/005 ,  B28D1/18 ,  E04G23/002

    摘要： [Problem]A mortar peeling method which can keep a sound generated during a peeling work to an allowable quiet sound and can peel a mortar off a concrete framework smoothly.[Solution]In a mortar peeling method, by gradually extending a piston rod 42 of a hydraulic jack 13 in a mortar peeling device 10A forward in one direction, a cutter 14 is gradually advanced forward in one direction so as to execute a mortar peeling process of peeling a mortar 21 with a predetermined thickness off a concrete framework 20 by using the cutter 14. In the mortar peeling method, after the piston rod 42 of the hydraulic jack 13 is extended forward in one direction and the mortar 21 is peeled, by retreating the piston rod 42 rearward in one direction, a session of the mortar peeling process is completed.

    摘要翻译： [问题]可以将剥离工作中产生的声音保持在允许的静音，并且可以顺利地将砂浆从混凝土框架剥离的砂浆剥离方法。 [解决方案]在砂浆剥离方法中，通过将砂浆剥离装置10A中的液压千斤顶13的活塞杆42沿一个方向向前方逐渐延伸，刀具14逐渐向一个方向前进，以执行砂浆剥离处理 通过使用切割器14将具有预定厚度的预定厚度的砂浆21从混凝土框架20剥离。在砂浆剥离方法中，在液压千斤顶13的活塞杆42沿一个方向向前延伸并且砂浆21被剥离之后，通过 在一个方向向后退位活塞杆42，完成砂浆剥离处理。

    Process for the structural reinforcement of fragile articles made of stone or agglomerates
    2.
    发明授权
    Process for the structural reinforcement of fragile articles made of stone or agglomerates 失效
    用于结构加固由石头或附聚物制成的脆弱物品的方法

    公开(公告)号：US4981539A

    公开(公告)日：1991-01-01

    申请号：US300335

    申请日：1989-01-19

    申请人： Luca Toncelli

    发明人： Luca Toncelli

    IPC分类号： B28D1/32 ,  B28B11/04 ,  B28D1/00 ,  B29C70/78 ,  C04B41/45 ,  C04B41/52

    CPC分类号： C04B41/52 ,  B28B11/04 ,  B28D1/005 ,  B29C70/78 ,  C04B41/4505 ,  B29K2105/12 ,  B29K2105/16 ,  B29K2709/00 ,  C04B2111/542 ,  Y10T156/1059

    摘要： The process provides for the structural reinforcement of manufactured articles made of stone or, in general, agglomerates by means of a sequence of steps which comprise the following: (a) the article to be treated is heated; (b) spraying on one surface of the article a particular adhesive called primer; (c) spraying on the same surface a resin preferably containing glass fibers or fibers of another material; (d) spraying on the same surface grit of stone having a constant and defined granulometry; (e) applying an action of vibration or compression on the article in order to facilitate the cohesion of the grit with the resin; (f) letting the resin undergo a catalytic reaction which eventually may require application of heat; (g) levelling the surface by mechanical operations. The same process may be repeated on the other surface of the article if one desires to cut the article along its thickness for the purpose of obtaining a very thin product. The process is also aplicable to agglomerated articles for the purpose of obtaining very thin products and of limited weight while the mechanical and aesthetic properites remain unaltered. The product obtained by the process of the application offers structural properties substantially superior to the properties of the starting articles and permits to utilize material which is structurally weak and defective.

    摘要翻译： 该方法提供了由石头制成的制品的结构加强，或通常通过包括以下步骤的步骤序列的附聚物：（a）待处理的物品被加热; （b）在制品的一个表面上喷涂称为底漆的特定粘合剂; （c）在相同的表面上喷涂优选含有玻璃纤维或其他材料的纤维的树脂; （d）喷洒在具有恒定和限定粒度的石头的相同表面砂粒上; （e）对制品施加振动或压缩作用，以便于砂粒与树脂的内聚力; （f）使树脂经历催化反应，最终可能需要加热; （g）通过机械操作调平表面。 如果需要沿着其厚度切割物品，为了获得非常薄的产品，可以在制品的另一个表面上重复相同的过程。 为了获得非常薄的产品和有限的重量，同时机械和美学特性保持不变，该方法也适用于附聚制品。 通过本申请方法获得的产品提供了基本上优于起始物品的性质的结构特性，并允许利用结构薄弱的材料。

    Method of making blocks and plates from pieces of marble and other natural stones
    4.
    发明授权
    Method of making blocks and plates from pieces of marble and other natural stones 失效
    从大理石和其他天然石块制作块和板的方法

    公开(公告)号：US4092393A

    公开(公告)日：1978-05-30

    申请号：US658968

    申请日：1976-02-18

    申请人： Giuseppe Marocco

    发明人： Giuseppe Marocco

    IPC分类号： C04B18/12 ,  B28B1/24 ,  B28B3/00 ,  B28B23/00 ,  B28D1/00 ,  B32B3/14 ,  B28B23/22

    CPC分类号： B28D1/005 ,  B28B23/0075 ,  B28B3/006

    摘要： Pieces of marble or similar natural stone having a plurality of plane faces are stacked in a liquid-tight container. Said pieces are arranged with their plane faces facing each other so as to form a plurality of parallel layers. Thereafter, a vacuum is applied in said container and, while maintaining the latter under vacuum, a fluid hardenable binding composition, such as a synthetic resin, is then poured into said container. Said composition flows down through the interstices existing in and around the stack of pieces, until it completely covers said stack. Thereafter, the inside of the container is brought to atmospheric or superatmospheric pressure, thus causing said binding composition to thoroughly penetrate into all said interstices and into all the cavities of the pieces opening on their surface, and then said binding composition is allowed to harden.

    摘要翻译： 将具有多个平面的大理石或类似天然石块装入液密容器中。 所述片被布置成它们的平面彼此面对以便形成多个平行层。 此后，在所述容器中施加真空，并且在真空下将真空保持在真空下，然后将流体可硬化的粘结组合物（例如合成树脂）倒入所述容器中。 所述组合物向下流过存在于堆叠件中的周围的间隙，直到其完全覆盖所述堆叠。 此后，容器的内部达到大气压或超大气压力，从而使所述粘合组合物彻底渗透到所有间隙中并进入其表面开口的所有孔中，然后使所述粘结组合物硬化。

    Wafer dividing apparatus and methods
    10.
    发明申请
    Wafer dividing apparatus and methods 有权
    晶圆分割装置及方法

    公开(公告)号：US20110053376A1

    公开(公告)日：2011-03-03

    申请号：US12805641

    申请日：2010-08-11

    申请人： Hotae Jin ,  Seonju Oh ,  HeuiSeog Kim

    发明人： Hotae Jin ,  Seonju Oh ,  HeuiSeog Kim

    IPC分类号： H01L21/304

    CPC分类号： H01L21/304 ,  B28D1/005 ,  B28D5/045 ,  H01L21/6708 ,  H01L21/67092

    摘要： Example embodiments are directed to a wafer dividing apparatus and method thereof. The wafer dividing apparatus includes a chuck unit having upper and lower chucks, a cutting wire that is provided in a space between the upper and lower chucks to cut a wafer and driven by a first driving unit, and an etchant supplying nozzle supplying etchant to a groove of the wafer, which is formed by the cutting wire.

    摘要翻译： 示例性实施例涉及晶片分割装置及其方法。 晶片分割装置包括具有上卡盘和下卡盘的卡盘单元，切割线设置在上卡盘和下卡盘之间的空间中以切割晶片并由第一驱动单元驱动，以及蚀刻剂供应喷嘴向蚀刻剂供应蚀刻剂 由切割线形成的晶片的槽。